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Articles by keyword: «Electroplating»

• “Au-Cysteine” Complex and its Application in Electro-Plating
  Published in: Advances in Environmental Science and Engineering (p3105)
• A Study of the Fabrication of Multi-Layer Microstructures Using ELID Grinding and the Thick Photoresist Lithography Technology
  Published in: Advances in Abrasive Technology V (p19)
• A Study on Adhesive Properties of a Damascene Electroplated Cu Composite Sheet
  Published in: Eco-Materials Processing and Design XII (p577)
• Analysis of a Microelectrostatic Motor
  Published in: Mechatronic Systems and Materials (p185)
• Application of TLP (Transient Liquid Phase) Bonding Method to the High T_m Lead-Free Solder
  Published in: PRICM-5 (p1869)
• Bonds of Electroplated Diamond Tools for Optical Glass Machining
  Published in: Advances in Grinding and Abrasive Technology XIII (p81)
• Brazing of Low Carbon Steel Automotive Radiator Pipe Using of Cu-Zn Alloy
  Published in: Fundamental of Chemical Engineering (p2718)
• Combined Manufacturing Process of Electrochemical-Etching and Electroplating on Nanoporous Silicon for its Metallization
  Published in: Advanced Engineering Materials (p393)
• Development of Bio-Mimetic Patterned IPMC Actuators with Multiple Electrodes
  Published in: Advances in Composite Materials and Structures (p1005)
• Development of Noble Metal Oxide Electrode for Low Oxygen Evolution
  Published in: Multi-functional Materials and Structures (p750)
• Effect of Current Density on the Magnetic Properties of Electroplated NiFe Layers
  Published in: Advanced Materials Processing II (p61)
• Effect of Inhomogeneous Intrinsic Stresses on the Cracking of Layered Brittle Coatings
  Published in: Interfacial Effects in Particulate, Fibrous and Layered Composite Materials (p351)
• Effect of pH Values on Magnetic Properties of Electroplated NiFe Layers
  Published in: Advanced Materials Processing II (p57)
• Effect of Plating Condition on the Mechanical Properties and Residual Stress of Electroplated Copper Film
  Published in: Advanced Materials and Processing (p637)
• Effect of Sintering Conditions on the Reliability of PMN-Based MLCC against Electroplating
  Published in: High-Performance Ceramics 2001 (p95)