Papers by Keyword: Etch Pit Observation

Abstract: The effect of sub-grain on the yield stress of pure copper single crystals with the [253] orientation was investigated by using the etch pit technique. The single crystal plates were successfully prepared from the seed crystals, which were produced at the melting temperature of 1473
K by the Bridgeman method. The present investigation confirmed the Hall-Petch relation concerning the effect of sub-grain boundaries on the macroscopic yielding of pure copper. The result derived from the extrapolation of the relationship of critical resolved shear stress (CRSS) and the initial dislocation density and sub-grain size is in good agreement with the evaluation in high purity copper single crystals of low dislocation density.

Abstract: In order to make clear the micro-yielding mechanisms of polycrystalline metals including twins, the movement of dislocations in the surface grains of Cu-6.8at%Al alloy and pure Mg polycrystals during the early stages of deformation was directly observed by using etch pit technique. The fresh dislocations multiply from the Frank-Read sources within the grains, and pile up against the twin and grain boundaries of two kinds of specimens. The pile-up dislocations on the primary and/or secondary slip planes are also confirmed in Cu-6.8at%Al alloys. Especially during the compressive loading for pure Mg, the occurrence of deformation twins is remarkable with an increase of strain rate, whereas the distribution of fresh dislocations tends to decrease in the surface grains. The present results suggest that the effect of twin boundaries on micro-yielding is almost equivalent for that of grain boundaries, which act as barriers to moving dislocations even in the pre-yield deformation.