Papers by Keyword: Flexible Board

Abstract: The usage possibility of conformal flexible boards for angular velocity sensors has been described. Production of such sensors allows us to solve the problem of constructing roll sensor for rapidly rotating body (20 Hz) along the longitudinal axis of which are speed reaching 200g, and also perpendicular speed up 20g. The paper also analyzed the possibility of using polyparaxylylene as dielectric and protective layer in conformal multilayer wiring boards (CMWB). Research tests for compliance with the requirements of the developed process conducted and research testing to the requirements of the developed technological process. The proposed approach has been developed and its efficiency has been demonstrated by various experimental scenarios.

Abstract: This paper reports on the development and characterization of piezoresistive stress and temperature sensors fabricated on silicon-on-insulator (SOI) wafer. The sensor chip consists of a 5x5 array elements enabling the simultaneous measurement of the absolute temperature as well as in-plane stress components in a temperature compensated manner. Each cell comprises a p-type piezoresistor rosette paralleling to the [110] crystal direction of silicon, an n-type piezoresistor rosette along the [100] crystal direction and a temperature sensor. Design, fabrication and characterization of piezoresistive and temperature sensors are described in detail. Moreover, based on the flexible printed circuit board, the prepackaging technique of sensors is reported and the electrical connections between the testing sensors and external measuring devices are achieved, then the changes in resistance versus temperature changes are measured in our experiment, the results show that this approach can be used for the signal measurement of sensor before the second packaging and on-line measurement of packaging stresses.