Papers by Keyword: Floating Polishing

Abstract: During the transferring process of the large die surfaces, there are extensive needs of die surface polishing. Since almost large die surfaces are free-form surfaces, currently, these are almost manually implemented. In order to overcome this barrier, in this paper, firstly, large die surfaces were geometrically characterized, and their polishing processes for the die surfaces features were then analyzed; secondly, the polishing pattern and structure of the floating polishing head were studied, finally, the affecting factors of polishing quality about the floating polishing were studied experimentally versus roughness of polished surfaces with the developed floating polishing experimental prototype in this paper. The affecting factors of polishing quality include the rotation speed of polishing discs, normal acting force on polishing disc, loci of polishing disc movement, feeding rate of polishing disc, grit of abrasive particles, and inclined angle of the acting force on disc, are synchronized and analyzed. These research results are used as operating guides for applications of the floating die polisher.

Abstract: Float polishing is one of the advanced ultra-smooth surface polishing techniques. Mechanical structure and polishing principle of float polishing are introduced. Polishing experiment about polishing ultra-smooth surface of GCr15 rectangular workpiece is performed by the CJY500 ultra-precision polishing machine, experimental results show that float polishing should be achieved metal nanometer level surface without degenerating layer. The application scope of float polishing is extended, the application has significant reference value for polishing ultra-smooth surface of metal workpiece.

Abstract: This research aimed to design and develop a polishing system for precision polishing mini roller mold to nanometer surface finish. An experimental polishing system was built in the present study to polish nickel plated specimens with various polishing compounds. The polished specimens were subsequently examined by Alfa-step, OM and SEM for surface finish, morphology and microscopic analysis respectively. The obtained surface condition and material removal rate were correlated to the polishing parameters such as spindle speed, abrasive concentration, and abrasive grit size for the improvement of the polishing effect. Mini-rollers of 5mm in diameter, 50mm in length were successfully polished to a surface roughness better than 2nm Ra in several hours without damaging the roundness and cylindricalness using abrasive of 0.3μm, 10,000rpm polishing speed and 0.5mm gap distance between polisher and the specimen. A semi-empirical model of polishing was also developed in the study for predicting the materials removal rate.

Abstract: Since almost large die surfaces are free-form surfaces, currently, almost all of large die surfaces are manually polished, causing low working efficiency and stability of die surface quality. In order to overcome this barrier, floating polishing is a feasible polishing technology. In the paper, a new kind of semi-automation polishing device is designed for large dies, by motion simulation and dynamics analysis of the polishing device based on software of Pro/e and ADAMS, the feasibility of function of the polishing mechanism and dynamics character of the key part are studied, the results show that the device has advantages of multi-degree-of-freedom, free location and indifferent equilibrium, the device may reduce die makers’ labor intensity, and short die delivery time.

Abstract: During the transferring process of the large die surfaces, there are extensive needs of die surface polishing. Since almost large die surfaces are free-form surfaces, currently, these are almost manually implemented. In order to overcome this barrier, base on design a floating polisher, this paper focuses on polishing rule of floating three polishing disks and the optimization of the associated polishing process parameters. In order to enhance the polisher performance, affecting factors of polishing process, including the rotation speed of polishing discs, normal acting force on polishing disc, loci of polishing disc movement, feeding rate of polishing disc, grit of abrasive particles, and inclined angle of the acting force on disc, are synchronized and analyzed versus roughness of polished surfaces. Then, using the parameter design plans and conducts tests regarding these affecting factors. Finally, the floating polishing process parameters are optimized based on the test results. These optimized results are used as operating guides for applications of the floating die polisher.

Abstract: Since almost large die surfaces are free-form surfaces, currently, these are almost manually implemented. In order to overcome this barrier, floating polishing is a feasible polishing technology. The contact pressure between grain and workpiece is a key problem of floating polishing technology. This paper focuses on contact pressure between grain and workpiece. At first, study the friction bound condition between grain and workpiece by ANSYS analysis software, then, compare with the analysis results of slip-line field theory and the test results of single grain. The results show the feasibility of the hypothesis of full friction condition. Finally, study the contact pressure between polishing disk and workpiece using the analysis results of single grain. The research achievements will be used for developing the floating polishing.

Abstract: During the transferring process of the large die surfaces, there are extensive needs of die surface polishing. Since almost large die surfaces are free-form surfaces, currently, these are almost manually implemented. In order to overcome this barrier, this paper focuses on a new technology of floating polishing, including a) the design of polisher body which has five degrees of freedom and realize the floating polishing while keep the polishing head being indifference equilibrium within the working range, b) normal force of polishing head on die surface analyses and experimental verification by using the slip line field method, and c) establishments of the interference boundaries between dies surface features and polishing head. The research achievements will be used for the development of a portable, state-of-the-art polishing machine and the optimization of the associated polishing process parameters in near future.