Papers by Keyword: Focused Ion Beam

Abstract: The deployment of silicon carbide (SiC) power devices in aerospace applications is constrained by their unexpected susceptibility to single-event effects (SEEs), despite the inherent advantages of wide bandgap materials. In this work, we experimentally investigate the SEE mechanisms in in-house fabricated 1200 V SiC VDMOSFETs under heavy-ion irradiation using Ta ions with a LET of 75 MeV·cm²/mg. Real-time current monitoring, post-irradiation electrical characterization, and focused ion beam (FIB) analysis were employed to systematically examine device degradation and failure modes under various bias conditions. The results demonstrate a clear progression of damage with increasing bias voltage: no significant changes, single-event gate leakage degradation (SEGLD) at 100 V, single-event leakage current (SELC) in both I_d=I_g and I_d>I_g modes at 300–400 V, and catastrophic single-event burnout (SEB) at 500 V. Structural analyses reveal progressive deepening of gate oxide fractures, extension into the P+ source region, and eventual source metal melting, consistent with the observed electrical degradation. Notably, the threshold voltage remained stable throughout, suggesting that localized damage to limited unit cells has minimal influence on the global device threshold. These findings provide critical insights into SEE-induced degradation pathways in SiC MOSFETs and offer valuable guidelines for the design and radiation hardening of next-generation aerospace power systems.

Abstract: This chapter aims at reviewing the characterisation techniques that are commonly used for high temperature oxidation study, especially on stainless steels. In addition, the experimental studies about the high temperature oxidation i.e. thermogravimetric method and chromium volatilisation measurement are explained. The various kinds of characterisation techniques for physico-chemical and electronic properties of thermal oxide scales are reviewed, starting from optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS), focused ion beam coupled with scanning electron microscope (FIB/SEM), X-ray diffractometer (XRD), X-ray photoelectron spectroscopy (XPS), Raman spectroscopy (RS), and photoelectrochemical characterisation (PEC). The review focuses on the basic concepts and shows how the characterising tools can be applied to thermal oxide characterisation.

Abstract: The paper shows results of microscale experimental tests performed on cement paste specimens fabricated by focused ion beam milling. The specimens are prepared in the form of cantilever beams and loaded in bending by nanoindenter. The dimensions of specimens are in the order of a few micrometers which corresponds to the single phase size. Intact and notched specimens with a stress concentrator are tested. Tensile strength and fracture energy are derived for the hydration product by analyzing the nanoindentation data and with the aid of analytical and numerical modeling. Although small number of tests is performed good correlation of the results is reached with respect to the available literature and molecular dynamic simulations.

Abstract: A tool for fabricating micro/nanopatterns was utilized in space optics, virtual reality, augmented reality, and semiconductor industry. Nowadays, demand of manufacturing technique for ultra-precision is continuously increasing virtual reality and augmented reality industry across the board and core technique for manufacturing next generation lens is cutting tool fabricating technique with nanoscale. In particular, tools of micro/nanosize for ultra-precision machining was made by using an ultra-precision grinding, but it was difficult to fabricate tools which have under micro scale. Recently, results of studies with many researchers were pulsed laser ablation, electric discharge machining and precision grinding. However, previous studies are unsuitable in making tools of micro/nanoscale. Due to unique physical properties of diamond, it can be easily controlled by using focused ion beam. The surface properties of the diamond layer are affected because of the amorphous damage caused by the FIB gallium ions collision, implantation and these effects can make to be able to control the geometry of cutting tool. In this study, we carried out in fabricating diamond tools under micro scale by using FIB milling through various process studies and determined in order to optimize the length of unstable tool.

Abstract: The dislocation analysis of latent scratch induced chemical mechanical polishing process on 4H-silicon carbide (SiC) using the multi directional scanning transmission electron microscopy (STEM) method and elastic stain measurement were performed. A scanning electron microscope image shows that a latent scratch extended toward the [30] direction and the width is about 50 nm. Cross sectional STEM images shows that the depth of latent scratch due to distortion is about 20 nm. From the result of plan view STEM observation along [000] direction, it was observed that a latent scratch had two defect lines toward the [30] direction, which were a loop type on upper side and a linear type on the lower side. The Burgers vector of each defect have a component in basal plane. Elastic strain mapping was performed using transmission electron microscope equipped with a procession diffraction system. Inside the latent scratch indicates stain-free field, however around latent scratch indicates compressive strain field. About 1.5 % compressive strain field x, y direction and shear strain along latent scratch exists on typical area. As a results of STEM and elastic strain analysis, the atomic arrangement in basal plane seems to be related with the compressive strain around latent scratch.

Abstract: This study deals with experimental determination of tensile properties of cement paste hydration products at micro-scale. Cantilever micro-beams with length of about 16 µm and pentagon cross section with micrometer dimensions were fabricated by focused ion beam milling on hydrated cement paste samples. Nanoindentation was used for evaluating elastic properties while tensile properties were derived from beam bending tests. Displacement controlled micro-scale tests give access to both tensile strength and estimates of fracture energy based on the load-displacement curves measured with the nanoindenter. The mean tensile strength and the fracture energy of inner hydration product were assessed as 791 MPa and 16.7 J/m², respectively. The huge difference of the micro-scale properties when compared to macroscopic values comes from the scaling properties of concrete.

Abstract: Texturing on the surface of cutting tools is an effective method to improve the friction and resultant machining performances of the tool. In this study, to fabricate nanotextures on various tools used for precision cutting, a patterning method on nanopolycrystalline diamond and cubic boron nitride tools was investigated using focused ion beam (FIB) irradiation and heat treatment. Patterning was possible using this method, and the patterning characteristics were different from those of single-crystal diamond. This method was more suitable for cutting tools compared with direct FIB machining because of its high efficiency and significantly low affected layer.

Abstract: The preparation of thin lamellas by focused ion beam (FIB) for MEMS-based in situ TEM experiments is time consuming. Typically, the lamellas are of ~5μm*10μm and have a thickness less than 100nm. Here we demonstrate a fast lamellas’ preparation method using special fast cutting by FIB of samples prepared by conventional TEM sample preparation by argon ion milling or electrochemical polishing methods. This method has been applied successfully on various materials, such as ductile metallic alloy Ti₆₈Ta₂₇Al₅, brittle ceramics K_0.5Na_0.5NbO₃-6%LiNbO₃ and semiconductor Si. The thickness of the lamellas depends on the original TEM sample.

Abstract: A diamond tip with included angle of 90° and fillet radius of 45 nm is developed combining precision grinding and focused ion beam. Relatively high speed scratching at 8.4 m/s induced by the developed diamond tip is conducted on silicon (Si) (111) plane using an ultraprecision grinder. Width at the onset of chip formation on a Si wafer is 193 nm. Width and depth at the onset of crack formation are 1125 and 94 nm, respectively. Calculated normal forces at the onset of chip and crack formations are 424 μN and 14 mN, respectively, corresponding to the depth of cut is 44 and 466 nm.

Abstract: Micro/nanoscale diamond cutting tools used in ultra-precision machining can be fabricated by precision grinding, but it is hard to fabricate a tool with a nanometric cutting edge and complex configurations. High-precision geometry accuracy and special shapes for microcutting tools with sharp edges can be achieved by focused ion beam (FIB) milling. However, in the FIB milling process, the surface properties of the substrate (such as a diamond substrate) are affected by the amorphous damage layer caused by the FIB gallium ion collision and implantation and these influence the diamond cutting tool edge sharpness and increase the processing procedure. In this study, to reduce the diamond cutting tool edge sharpness and processing procedure, FIB milling beam current and tilting angle characteristics of single-crystal diamond were investigated, along with method for decreasing the FIB-induced damage on diamond tools by platinum (Pt) coating on the diamond substrate. Experimental results revealed that optimize beam current, tilting angle and platinum (Pt) coating could lead to relatively few processing procedure and sharp cutting tool edge. The obtained results are an endeavor to enhance the controllability of the diamond cutting tool FIB milling.