Papers by Keyword: GaAs Wafer

Abstract: GaAs are one of the most important semiconductor followed silicon, GaAs wafers are the mostly used substrates for fabricating integrated circuits (ICs). So the quality of ICs depends directly on the quality of GaAs wafers. A series of processes are required to manufacture high quality GaAs wafers. This paper reviews the literature on polishing technology of GaAs wafers, covering the history, summarizes the effects of slurry’s chemical and physical characters such as pH, oxidants, abrasive grit, velocity, and temperature in the polishing process. It also discusses some possible topics for future research.

Abstract: The abrasive ice disc chemical mechanical polishing (AID-CMP) is a potential polishing process in the semiconductor industry to realize superior surface finish and planarity for semiconductor wafers. In this paper we investigated the temperature field during GaAs wafer AID-CMP process for a better understanding of AID-CMP. The results show that the AID outer temperature is higher than the inner, and the highest temperature in AID is at the wafer/AID contact zone. The increases of Pc, v, eh and tp will generate more energy and cause more local melting during GaAs wafer AID-CMP process. The AID temperature and the area of highest temperature zone increase with increasing Pc, v, and eh. The nodes temperature increase in every conditions adopted as tp increases. The area of melted zone and thickness of melted ice increase with increasing Pc, v, eh and tp.

Abstract: We demonstrated an experiment of femtosecond-laser damage threshold on GaAs wafer, the damage threshold was measured from 50 to 400fs. The mechanism was discussed through injection power, pulse duration and ablation profile. The results showed that the damage threshold increased with the pulse duration, the relationship between diameter of ablation hole and laser power density was also analyzed. It was concluded that the main factor affecting the damage threshold was photon ionization and collision ionization.