Papers by Keyword: GaN

Abstract: This paper introduced an accurate empirical model for the thermal resistance of a single-finger AlGaN-GaN high electron mobility transistor (HEMT) on three different substrates including Sapphire, SiC and Si. The model reckons the constant thermal conductivity of GaN and substrate, thickness of host substrate layers, gate length (Lg) and width (Wg). The model plausibility is verified by comparing it with DC channel temperature measurement method and charge controlled based device modeling which agrees very favorable observation of the model data. Having nimble expression for the channel temperature is of inordinate importance in the field of designers of power device and monolithic microwave integrated circuits. Proposed model gives a variety of inquiries that would be impossible or impractical to do using time-consuming numerical simulations.

Abstract: Tantalum carbide (TaC) coating, produced in an ultrahigh temperature chemical vapor deposition (CVD) process, exhibited high thermal and chemical stabilities, low emissivity, and high purity. Low emissivity of 0.3~0.43 was measured on TaC coating at 1000°C and compared with the one of SiC coating. As revealed in both simulation and experiment, the low emissivity of TaC coatings not only improves temperature uniformity in the SiC PVT process, but also reduces power consumption in both SiC crystal growth and GaN epitaxial deposition. The results provide important guidance to process tuning when switching from a conventional graphite or SiC-coated component to its TaC-coated counterpart.

Abstract: In order to selectively analyze active thin layers close to surface in power devices structures, Raman scattering is necessary with UV excitation. However, the Raman spectra of GaN are usually affected by the direct bandgap photoluminescence of the material, which interferes with the Raman measurements and decreases the quality and resolution of the Raman spectra. In this work, we demonstrate experimentally that nanostructured aluminum films deposed on GaN epitaxial layers decrease the influence of the photoluminescence on the resonant Raman spectra and increase its overall spatial resolution under UV illumination.

Abstract: In this work, the effect of high temperature molten KOH wet etching on GaN/AlGaN epilayer has been investigated for different family of dislocations. The high etching temperature (up to 510°C) allows a good definition of the pits, making easy the observation and the counts. Such high temperature will allow a detailed study on the statistical distribution of the dislocations on whole wafer by optical microscope for screw/mixed dislocation. A comparison on dislocation density between AlGaN/GaN structure grown on Si (111) substrate and 4H-SiC substrate has been performed.

Abstract: The article describes the methods for producing thin films and structures based on SiC, GaN and their SiC – AlN and Al – GaN solid solutions, as well as mathematical models of film growth and properties-behavior of the I–V characteristics of heterostructures. Two models were developed for producing thin films and heterostructures based on SiC, GaN and their solid solutions. The first model makes it possible to determine the sputtering coefficient when producing films by high-frequency magnetron sputtering. In the second quantum-mechanical model, the equation for the gap of the mean field of condensate was built and the growth rate of a film on the crystalline substrate was determined. The current-voltage characteristic of the transistor based on the AlGaN / GaN heterosystem was provided. The models for the growth of heterostructure films made it possible to modify the technologies for producing perfect SiC crystals and SiC – AlN solid solutions. It was possible to offer a pilot plant for growing SiC crystals with improved control over the modes of induction high-temperature heating of the growth crucible.

Abstract: GaN based electronic devices have gained great success in the arena of high-frequency and high-power applications. A high-quality GaN MOS structure has the potential to enable new device designs and higher device performance, thereby bringing the success of GaN electronics to a new level. This paper discusses results of the work on GaN MOS structures show that with adequate surface preparation samples featuring interface trap density down to the ~ 10¹⁰ eV^-1cm^-2 range can be formed.

Abstract: With the development of high-voltage switches and high-speed RF circuits, the enhancement mode(E-mode) AlGaN/GaN HEMTs have become a hot topic in those fields. The E-mode GaN-based HEMTs have channel current at the positive gate voltage, greatly expanding the device in low power digital circuit applications. The main methods to realize E-mode AlGaN/GaN HEMT power devices are p-GaN gate technology, recessed gate structure, fluoride ion implantation technology and Cascode structure (Cascode). In this paper, the advantage and main realizable methods of E-mode AlGaN/GaN HEMT are briefly described. The research status and problems of E-mode AlGaN/GaN HEMT devices fabricated by p-GaN gate technology are summarized. The advances of p-GaN gate technology, and focuses on how these research results can improve the power characteristics and reliability of E-mode AlGaN/GaN HEMT by optimizing device structure and improving process technology, are discussed.

Abstract: Wide bandgap semiconductor technology has been generating a great deal of attention due to its fundamental advantages in high power electronics. Understanding and effective control of interfacial properties belong to a group of critical issues requiring progress. In this work, we report progress in wide bandgap interface characterization, achieved using photo-ionization of deep traps under a non-equilibrium condition created by corona-charge bias in deep depletion. This characterization capability is demonstrated on oxidized n-type epitaxial SiC with deep interfacial traps invisible in standard C-V. These traps, initially present at high density, are shown to be reduced by half after a wet anneal. The photo-ionization technique is incorporated in commercially available non-contact C-V (CnCV) metrology [1,2] providing a non-invasive, cost and time saving metrology that benefits development research as well as device fabrication.

Abstract: We report significant advancements in corona-based non-contact capacitance-voltage (CnCV) metrology recently developed for comprehensive C-V characterization of SiC and other wide bandgap semiconductors. The technique answers the industries needs for nondestructive, cost-effective C-V dopant monitoring for material and device development and manufacturing control. Excellent precision and matching to mercury probe CV is demonstrated for SiC, Ga₂O₃, GaN and AlGaN/GaN structures over a concentration range from 10¹⁴cm^-3 to 2x10¹⁹cm^-3. The emphasis in the present work is on improvement of CnCV in dopant depth profiling resolution and measurement throughout. This is achieved with a variable charge method that in-situ adjusts corona charging increments in response to changes in dopant concentration. Results are presented for multi-layer epitaxial SiC and for 2DEG in AlGaN/GaN HEMT structures. The latter represents an extreme case of high-low concentration profiling with a transition from 10²⁰electrons/cm^-3 in the 2D electron gas to a fully depleted well and dopant concentration in the 10¹⁵cm^-3 range.

Abstract: The defect structure of Mg implanted GaN substrate was evaluated by TEM observations, AFM surface observations and Raman scattering spectroscopic analysis. Mg ions were implanted at room temperature (RT) and 500 °C. TEM results showed that the defect distribution along depth scale is different between RT and 500 °C condition. The several peaks originated from ion implantation were found from Raman scattering spectra and the characteristics of the defects by implantation were discussed. The crystal quality of the sample implanted at 500 °C was found to be better than that of RT by comparing the FWHM of the E₂ peak.