HOME CONTACT My eBook

Username: Password:

> @scientific.net

Articles by keyword: «Grain Boundary»

• Thermal Residual Micro-Stress Concentration and Strength of SiC-Alumina Nanocomposites
  Published in: The Science of Engineering Ceramics II (p397)
• Thermal Vacancy Formation and Diffusion in Nanocrystalline Materials
  Published in: Positron Annihilation - ICPA-12 (p35)
• Thermodynamic and Kinetic Properties of Grain Boundary Junctions
  Published in: Recrystallization and Grain Growth IV (p243)
• Thermodynamic Approach to the Description of Steady-State Phase Composition of Alloys Obtained by Mechanical Alloying Technique
  Published in: Metastable, Mechanically Alloyed and Nanocrystalline Materials 2002 (p209)
• Thermodynamic Description of the Phase Transformation Mechanism during Mechanical Alloying Process
  Published in: Metastable, Mechanically Alloyed and Nanocrystalline Materials 1999 (p591)
• Threshold Stress for Super Plastic Flow in Spatially Extended Crystalline Systems
  Published in: PRICM-5 (p3013)
• Toughness after Interrupted Quench
  Published in: Aluminium Alloys 2006 - ICAA10 (p1017)
• Towards Innovation in Superplasticity, A Brief Review on the Project
  Published in: Towards Innovation in Superplasticity II (p3)
• Treedimensional Modelling of a Back Junction Solar Cell Made with Improved Polycrystalline Silicon Wafers
  Published in: Polycrystalline Semiconductors III (p471)
• Triple Junction Diffusion: Experiments and Models
  Published in: Diffusion in Materials DIMAT2000 (p1265)
• Triple Junctions in Polycrystalline Silicon: A Numerical Study Based upon Atomistic Simulations
  Published in: Experimental Techniques and Design in Composite Materials 5 (p307)
• Twinning Behavior in AZ31-B Polycrystal Texture Subjected to In-Situ Bending Test
  Published in: PRICM7 (p715)
• Two-Dimensional Grain Growth Simulation by Local Curvature Multi-Vertex Model
  Published in: Recrystallization and Grain Growth IV (p551)
• Unusual Solid Gallium Penetration in Polycrystalline Aluminum
  Published in: Diffusion and Reactions (p245)
• Vacancy Model for Threshold Electromigration in Thin Metallic Films
  Published in: Diffusion in Materials DIMAT2000 (p55)