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Articles by keyword: «Grain Growth»

• Texture Memory Effect in Heavily Cold-Rolled Ni₃Al Single Crystals
  Published in: THERMEC 2006 (p1513)
• Textures and Grain Growth in Nanocrystalline Fe-Ni Alloys
  Published in: PRICM-5 (p3483)
• Textures of Thin Films
  Published in: Texture and Anisotropy of Polycrystals (p55)
• The Characteristics of Ferroelectric Sr_0.4Ba_0.6Nb_2-xV_xO₆ Dielectrics
  Published in: High-Performance Ceramics V (p136)
• The Control of Texture and Grain Boundary Microstructure by Magnetic Annealing
  Published in: Textures of Materials - ICOTOM 14 (p1151)
• The Development of Grain-Specific Texture and Grain Boundary Character during Grain Growth of Al-1%Si Films on SiO₂/Si Substrates
  Published in: Recrystallization '92 (p619)
• The Effect of B₂O₃ Addition on the Sintering of Sb₂O₃ Doped BaTiO₃
  Published in: Euro Ceramics VIII (p1333)
• The Effect of Grain Boundary Junctions on Grain Microstructure Evolution: 3D Vertex Simulation
  Published in: Recrystallization and Grain Growth III (p1051)
• The Effect of High Temperature Grain Refinement on the Isothermal Ferrite Grain Growth Kinetics in Steel S460
  Published in: Recrystallization and Grain Growth IV (p907)
• The Effect of Humidity on Recrystallization and Aging of Plastically Deformed Alkali Halide Crystals
  Published in: Recrystallization and Grain Growth (p567)
• The Effect of Microstructure on Fracture Toughness for Silicon Nitride Ceramics
  Published in: The Science of Engineering Ceramics II (p195)
• The Effect of Processing Conditions on the Microstructures of α-SiAION Ceramics
  Published in: Nitrides and Oxynitrides (p213)
• The Effects of Thickness and Underlayer on Both Grain Growth and Internal Stresses in Cu Thin Films
  Published in: New Frontiers of Processing and Engineering in Advanced Materials (p417)
• The Microstructure Evolution of Copper and Gold Bonding Wires during Annealing
  Published in: Fundamentals of Deformation and Annealing (p399)
• The Phase-Field Simulation of the Grain Growth under External Field
  Published in: Materials and Manufacturing (p69)