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CONFERENCE
6/16/2013 - 6/19/2013
The 7th International conference on Physical and Numerical Simulation of Materials Processing
5/16/2013 - 5/19/2013
2nd International Congress on Advanced Materials
4/13/2013 - 4/14/2013
2013 2nd lnternational Conference on lntclligent Materials, Applied Mechanics and Design Science (IMAMD 2013)
more...
Articles by keyword: «
Grinding
»
357 papers on 24 pages:
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An Investigation on PRMMC Polishing with Electrochemical Mechanical Machining Process
Published in:
Surface Finishing Technology and Surface Engineering II
(p226)
An Overview of Ceramics Recycling in France
Published in:
Euro Ceramics V
(p2200)
Analysis and Simulation of Grinding Wheel Surface Topography
Published in:
Advances in Grinding and Abrasive Technology XIV
(p509)
Analysis of Grinding Parameters on Hardness Layer Depth
Published in:
Advances in Engineering Design and Optimization
(p131)
Analysis of Stress-Induced Birefringence in Nd:YAG Crystal
Published in:
Advances in Abrasive Technology IX
(p557)
Analysis of the Surface Residual Stress in Grinding Aermet100
Published in:
Physical and Numerical Simulation of Material Processing VI
(p318)
Application and Development of High-Efficiency Abrasive Finishing
Published in:
Manufacturing Process Technology
(p3113)
Applications of Contact Length Models in Grinding Processes
Published in:
Progress in Abrasive and Grinding Technology
(p113)
Applications of Efficient Energy-Saving Cement Grinding Technology and Equipment
Published in:
Manufacturing Processes and Systems
(p363)
Based on Monocular Vision of the Robot Coordinate for Grinding Surface within the Establishment
Published in:
Advances in Engineering Design and Optimization II
(p556)
Bifractal Characteristics of Ground Workpiece Surfaces
Published in:
Advances in Abrasive Processes
(p25)
Ceramic Grindability Evaluation with PCA Method
Published in:
Advances in Abrasive Technology IX
(p421)
Characterisation of the Effects of Grinding on Residual Stresses
Published in:
Residual Stresses VI, ECRS6
(p179)
Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers
Published in:
Advances in Abrasive Technology XI
(p36)
Characterization of the Response of Embedded Thermocouples in Grinding
Published in:
Advances in Abrasive Technology XIV
(p12)
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