Papers by Keyword: Grinding Mechanism

Abstract: This paper presents a surface generation mechanism of grinding that captures the microscopic interaction between the abrasive grains and work-surface. The mechanism utilizes both deterministic and stochastic formulations and deals with such realistic constraints as loss/wear and uneven distribution of abrasive grains, roughness of already-ground work-surface, and machine stiffness. Apart from the theoretical treatments, numerical examples are cited showing how the topography of the work-surface evolves because of the proposed mechanism. The work will help build computerized systems ensuring a reliable prediction of the surface roughness due to grinding under the realistic constraints.

Abstract: This paper via investigate the process of 9SiCr alloy steel in high efficiency deep grinding to find the rule between grinding wheel speed v_s depth of cut a_p and speed of table v_w with the grinding force and the surface quality. Intend to develop a suitable method of the grinding process of 9SiCr alloy steel in high efficiency deep grinding, to obtain high removal rate and good surface quality.

Abstract: This paper discusses the grinding performance of ZnS. Its the base for ultra-precision grinding to master the mechanical properties and removal mechanism of ZnS which is an infrared material. This study determined the hardnessfracture toughness and critical grinding depth by micro-indentation test; Based on the result of nanoindentation test, constitutive model of ZnS was established and simulation of indentation and scratch were completed. Grinding removal mechanism and effect of process parameters on scratch result were explored by scratch test. It was found that test was consistent with simulation.

Abstract: In the manufacture of ceramic components, it has been well documented that the grinding costs can be as high as 80% of the total cost. To reduce the grinding cost, massive research studies have been conducted and new types of high-performance machining techniques have been developed based on the fundamental understanding of the prevailing grinding mechanisms for engineering ceramics. The developments in grinding mechanisms and grinding processes are reviewed and summarized.

Abstract: This paper analysis the process of Al2O3 engineering ceramics grinding and study the mechanism of rotary ultrasonic-vibration grinding. Then setting the model of the material removal rate and grinding force, which is based on Creasing fracture mechanics. Results indicate rotary ultrasonic-vibration grinding can apparently improve the material removal rate and cut down the grinding force.

Abstract: The paper used indentation fracture mechanics model or cutting model to deal with the grinding removal mechanism of nanostructured ceramic coatings, the interaction between the abrasive grains and the workpiece was approximately regarded as ideal small-scale indentation phenomenon, it was used to evaluate the surface quality in ceramic machined processing that formation of grinding crack and its propagation process, the material removed process and the surface defects of the ceramic grinding, the cutting model proved that although the removed material is usually brittle removal, most of the grinding energy consumption was related with plastic deformation.

Abstract: The present investigation was dedicated to elucidate grinding characteristics during surface grinding of titanium alloy(TC6) and high temperature alloy (GH2132) by using silicon carbide(SiC) and sol-gel (SG) wheel respectively. The grinding characteristic of SG wheel on aeronautical alloys was studied on the base of systematical measurement of the grinding force, grinding temperature, surface roughness and grinding ratio. The results indicated that the SG grinding wheel possesses excellent grinding properties and is more suitable for grinding these aeronautical alloys compared with conventional abrasive tools. Finally, the grinding mechanism of new-typed SG wheel was unveiled on the base of the microcrystalline structure analysis of SG grains.

Abstract: The present work deals with the simulation investigation of chip formation in ultrasonically assisted grinding (UAG) of SiC ceramics with single diamond abrasive grain in order to reveal the material removal mechanism in UAG of SiC materials. In simulation, smooth particle hydrodynamic (SPH）method coupling FEM modeling is employed to overcome the large material distortions that occur in the simulation analysis of single point cutting process when only the finite element method (FEM) is used. The abrasive-grain is modeled with finite element while the target workpiece is modeled by SPH particles. The simulation results revealed that normal and tangential forces in UAG are smaller compared to those in conventional grinding (CG) without ultrasonic vibration. The scratch profiles shows that the cutting path appears to be sinusoidal when ultrasonic vibration is introduced in grinding process, which leads to a higher material removal rate than that without ultrasonic vibration.

Abstract: Grinding of metals is a complex material removal operation. Research on cutting process of a single abrasive grain is the basis of further understanding of grinding mechanism. In this investigation, the simulation and analysis for the non-uniform thermo-mechanical coupling intense stress fields in cutting zones of a single abrasive with negative rake are conducted by means of the FEM techniques. The cutting forces, the cutting temperature distribution and the strain rate in cutting zone are numerically demonstrated. Grinding mechanics are analyzed from microscopic view according to the simulation results. Research results facilitate a better understanding on the mechanics of grinding.

Abstract: In the present study, sawing forces of Al2O3 ceramic and wear of metal-bonded diamond cut-off wheel were examined by counting the statistical data of diamond wear and analyzing the force signals under different sawing conditions. The experimental results demonstrated that normal grinding force reduced with the increasing of sawing speed, and rose with the increasing of workpiece feed rate and grinding depth. In all of the variables, sawing depth made the greatest effects on normal grinding froce. The percentage of whole crystal or pull-out crystal decreased and fractured crystal increased as the sawing depth increased or the sawing speed decreased. Among machining factors, sawing speed was the greatest effectors on the wear of diamond cut-off wheel.