Papers by Keyword: HEC

Abstract: A novel self-adhesive wound dressing product was developed using a hydroxyethyl cellulose (HEC) hydrogel layered with a TAPE-gelatin bioadhesive. This wound dressing was then evaluated for its sorption properties through diffusion and swelling tests, and the parameters analyzed were hydrogel formulation, wound dressing thickness and adhesive layer thickness. Results showed that the wound dressing produced using 6% NaOH/5% thiourea in the crosslinking solution, with 2.5 mm hydrogel thickness, and 0.2 mm TAPE-gelatin thickness had the highest water absorbed. Lastly, analysis on swelling kinetics based on a previous study was conducted to determine the diffusion coefficients for the composite wound dressing.

Abstract: This paper contrastively analyses the consolidation instances of silt with HEC and HAS soil consolidators, also emphatically discusses the influence regularities of the compressive strength of solidified soil with the following factors: the dose of consolidators and the curing time. Meanwhile, from the point of view of experiment, this paper studies the physical and mechanical properties of solidified soil. Case study shows that HEC and HAS soil consolidators behave as well as cement and lime in road-construction engineering, and even that filling subgrade independently. Also, this paper proposes the appropriate value 6% of HEC and HAS soil consolidators for solidifying silt layer, which can be used as reference for the similar geological conditions.

Abstract: The effect of surface states of substrate and additives on copper electrodeposition for thin film applications was investigated. Titanium substrate states were mechanically and chemically moderated and several additives such as Arabic gum, hydroxyl ethyl cellulose, and chlorine were used during electrodeposition process under a constant current condition with current density of 500 mA/cm2. Results obtained using SEM, X-ray, and AFM for early stage of copper nucleation and growth revealed that substrate conditions and additives appear to be effective in producing uniformly-distributed copper nuclei and their subsequent growth in a regulated manner of surface leveling. The shape of copper nuclei was clearly affected by the surface state of the substrate. It seems to be related with dislocations produced on the titanium cathode during surface moderating. Hardness, growth direction, and resistivity of copper deposits changed with the kind of additives.