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Articles by keyword: «Heat Dissipation»

• A Design of Ring-Shaped LED Driving Circuit Used in Optical Instruments Illuminating System
  Published in: Advanced Materials in Microwaves and Optics (p269)
• An Investigation of Heat Dissipation in High Speed Machining
  Published in: Ultra-Precision Machining Technologies (p480)
• Analysis of Heat Dissipation and the Energy Conservation in Cast Iron Dryer Head of Paper Machine
  Published in: Frontiers of Manufacturing Science and Measuring Technology II (p293)
• Design Thermal Structure of Aluminum Plate LED
  Published in: Manufacturing Process Technology (p1498)
• Dissipative Behaviour of Metallic Materials in Low Stress Cyclic Loading
  Published in: Advances in Experimental Mechanics IV (p253)
• Fatigue Dissipation and Failure in Unidirectional and Angle-Ply Glass Fibre/Carbon Fibre Hybrid Laminates
  Published in: Experimental Techniques and Design in Composite Materials 5 (p35)
• Laser Annealing of Implanted Semiconductor Layers – One Bridge to Nano-Processing
  Published in: Rapid Thermal Processing and beyond: Applications in Semiconductor Processing (p237)
• Plastic Dissipation and Temperature Field around a Steady Running Crack
  Published in: Fracture and Damage Mechanics V (p895)
• Research Progress on Packaging Thermal Management Techniques of High Power LED
  Published in: Renewable and Sustainable Energy (p3989)
• Study on Process of Planing Forming of Plate Fin Heat Sinks
  Published in: Advances in Materials Manufacturing Science and Technology II (p237)
• Study on the Factors Influencing Spreading Resistance of Heat Sinks
  Published in: Advanced Measurement and Test (p165)
• Synergistic Effect of Hybrid Filler Contained Composites on Thermal Conductivity
  Published in: Eco-Materials Processing and Design VIII (p483)
• Thermal Resistance and Heat Dissipation of LED PCB with Thermal Vias
  Published in: Applications of Engineering Materials (p789)
• Thermal Resistivity Properties of LED Packages with Thermal via
  Published in: Multi-Functional Materials and Structures III (p511)
• Variation of Heat Dissipation Properties of LED Packages with Thermal Vias
  Published in: PRICM7 (p2811)