Papers by Keyword: Interface Defects

Abstract: We investigate surface potential fluctuations on SiO₂/SiC interfaces by local capacitance-voltage profiling based on time-resolved scanning nonlinear dielectric microscopy. As experimental indicators of surface potential fluctuations, we measured the spatial fluctuations of local capacitance-voltage and its first derivative profiles through the detection of the voltages at the infection points of the profiles. We show that, even for a sample with a nitrided interface with low interface defect density, the fluctuations of the measured voltages are much higher than the thermal energy at room temperature. This indicates the existence of high potential fluctuations, which can give the significant impacts on the carrier transport at the SiO₂/SiC interface of SiC metal-oxide-semiconductor field effect transistors.

Abstract: In this work, the interface between 4H-SiC and thermally grown SiO₂ is studied using low energy muon spin rotation (LE-μSR) spectroscopy. Samples oxidized at 1300 °C were annealed in NO or Ar ambience and the effect of the ambience and the annealing temperature on the near interface region is studied in a depth resolved manner. NO-annealing is expected to passivate the defects, resulting in reduction of interface traps, which is confirmed by electrical characterization. Introduction of N during annealing, to the SiC matrix, results in a thin, carrier rich region close to the interface leading to an increase in the diamagnetic asymmetry. Annealing in an inert environment (Ar) seems to have much lesser impact on the electrical signal, however the μSR shows a reduced paramagnetic asymmetry, indicating a narrow region of low mobility at the interface.

Abstract: GaN based electronic devices have gained great success in the arena of high-frequency and high-power applications. A high-quality GaN MOS structure has the potential to enable new device designs and higher device performance, thereby bringing the success of GaN electronics to a new level. This paper discusses results of the work on GaN MOS structures show that with adequate surface preparation samples featuring interface trap density down to the ~ 10¹⁰ eV^-1cm^-2 range can be formed.

Abstract: In this work, the potential of muon spin rotation (μSR) with low-energy muons (LE-μ) for the investigation of oxidation-induced defects at the SiO₂/4H-SiC interface is explored. By using implantation energies for the muons in the keV range and comparing the fractions of muonium in different regions, the depth distribution of defects in the first 200 nm of the target material can be resolved. Defect profiles of interfaces with either deposited or thermally grown SiO₂ layers on 4H-SiC are compared. The results show an increased number of defects in the case of a thermal oxide, both on the oxide and on the SiC side of the interface, with a spatial extension of a few tens of nm.

Abstract: It has recently been shown that interface defect density (D_it) at SiO₂/SiC interfaces can have non-uniform clustered distribution through the measurement by local deep level transient spectroscopy (local DLTS). Here we investigate the influence of the non-uniform D_it clustering on the field-effect mobility in SiC metal-oxide-semiconductor field effect transistors (MOSFETs) by device simulation. We develop a three dimensional numerical model of a SiC MOSFET, which can incorporate actual D_it distributions measured by local DLTS. Our main result is that the impact of the non-uniform D_it clustering on field-effect mobility is negligible for a SiC MOSFET with high D_it formed by dry thermal oxidation but it becomes significant for that with lower D_it by post-oxidation annealing. The result indicates that channel mobility can be further improved by making D_it distribution uniform as well as reducing D_it.

Abstract: Current-voltage characterization and thermal dielectric relaxation current (TDRC) measurements are carried out on 4H silicon carbide (SiC) n-channel MOSFETs processed with different post oxidation anneals (POAs) in O₂, N₂O, and NO atmospheres at high temperature. In all samples we observe a distinct peak at a temperature of 70 K in the TDRC spectra due to a defect close to the conduction band of 4H-SiC having a high density of states (>10¹³ cm^-2eV^-1). We show that this defect is related to the degradation of the device performance such as the MOSFET conductivity. Comparing the different POAs, NO strongly reduces the density of states close to the conduction band and thus increases the amount of free channel electrons. Based on TDRC measurements we want to suggest a method for more accurate estimation of the true channel mobility accounting for the reduced channel electron density due to trapping.

Abstract: We studied interface defects of C-face 4H-SiC metal-oxide-semiconductor field-effect transistors (MOSFETs) by means of electrically-detected-magnetic-resonance (EDMR) spectroscopy. EDMR measurements were carried out on opposite types of C-face MOSFETs, which were prepared by dry oxidation and wet oxidation, and we found EDMR signals of interface defects from both the MOSFETs. Judging from their spectroscopic features, the interface signals of the two MOSFETs are assigned to be the same type, and we call them “C-face defects.” The density of C-face defects was found to be larger in the dry-oxide MOSFETs than in the wet-oxide MOSFETs. It is also revealed that part of C-face defects in wet-oxide MOSFETs are coupled with hydrogen atoms.

Abstract: Wet and N₂O oxidized SiO₂/SiC for C-face substrates were comprehensively investigated to clarify the origin of oxide defects which affect channel mobility and threshold voltage stability by using leakage-current analysis. The estimated defects are identified by cathode luminescence, X-ray photoelectron spectroscopy, and high-resolution Rutherford backscattering spectroscopy. The origin of the observed oxide defects might be complex defect of O vacancy defects and/or C related defects including N.

Abstract: The radiative defect centers in thermally-grown SiO₂/4H-SiC structures with high-temperature post-oxidation annealing (POA) in various ambient gas, i.e. Ar, H₂, and NO_x, were examined using cathodoluminescence (CL) measurement. It was found that radiative centers with an extremely high luminescent efficiency were remained at the SiO₂/SiC interfaces after Ar-POA and FGA. Thus, these defect centers are very stable against high-temperature annealing and reducing ambient. In contrast, NO_x-POA significantly reduced amounts of the radiative defects that might be related to channel mobility improvement in SiC-MOSFETs.

Abstract: Anneals in nitrogen (N) containing atmosphere have been proven as efficient means of improving the channel mobility of SiC MOSFETs. It has been demonstrated that simultaneously the density of interface traps is reduced. However, this process is not yet fully understood. In this study we show a comparison of MOSFETs annealed in different atmospheres and compare their electrically detected magnetic resonance (EDMR) spectra with electrical parameters. We find hints for the N incorporation not only passivating but also creating or transforming defects.