Papers by Keyword: Interface Strength

Abstract: We report on the mechanical response of semiconductor substructures formed by InP membranes bonded to silicon. The bonded surfaces are of the order of ~ 1 cm2 and were bonded using oxide-free direct wafer bonding. Both the plastic response of the InP membrane and the InP/Si interface strength have been investigated using instrumented nanoindentation.

Abstract: Stress singularities exist on the interface endpoint or internal point, consisting of dissimilar linear elastic bonded wedges. The eigenvalue λ is an important parameter to represent the stress singularity on the interface singular point. And smaller eigenvalue represent stronger stress singularities on the interface singular points. The angular function is another parameter to represent stress singularities around singular points. It is known that the eigenvalue is influenced by the Young’s modulus, Poisson’s ratio and interface angles. The Airy stress eigenfunction method has been used to solve the eigenvalue on the bi- and tri-material junctions by verifying the Young’s modulus. And then talk about angular functions around the bi- and tri-material junctions’ singularity point. At last discuss the feasibility of enhancing the interfacial bonding strength in engineering practice.

Abstract: Abesive jet machining (AJM) of silicon carbide fiber reinforced silicon carbide ceramic composite (SiC/SiC CMC) was carried out with various size of silicon carbide fine abresives. A micro indentation experiment was connected to evaluate of maerial removal mechanism by the particle impact. Results showed that the machine rate was different depending on the particle size and that inteface fracture (debonding) has influenced on the material removal mechanim. Relationship between structure scale of the SiC/SiC CMC and the impact media size was discussed.

Abstract: Clad metal sheets are composed of one or more different materials joined by resistance seam welding, roll-bonding process, etc. Good formability is an essential property in order to deform a clad metal sheet to a part or component. Temperature is one of the major factors affected the interface strength and formability on warm forming of multilayered sheet metal. In this study, the mechanical properties and formability of a Mg-Al-SUS clad sheet are investigated. The clad sheet was deformed at elevated temperatures because of its poor formability at room temperature. Tensile tests were performed at various temperatures above 250°C and at various strain rates. The limit drawing ratio (LDR) was obtained using a deep drawing test to measure the formability of the clad sheet. Interface strength and fracture pattern were changed mainly by temperature. Uniaxial tensile strength represents entirely different type below and above 200°C at also different strain rate. Mg alloy sheet was fractured earlier more than SUS and Al alloy sheet below 250°C testing temperature. On the contrary, Mg alloy sheet was elongated much more than other metals above 250°C.

Abstract: For dental/orthopedic implants to achieve better bone apposition and bone-implant bonding, various approaches to improve titanium surfaces have been developed. Recently, a fluoridated hydroxyapatite (FHA) coating on titanium (Ti) implants was made by sol–gel method and shown to be a possible applicative bone implant. The purpose of the current study was to evaluate biological responses and biomechanical bonding strength of FHA coated Ti implants as compared with that of the conventional Ti alloys and hydroxyapatite (HA) coated Ti implants. In vitro assays were made using human osteoblast-like cell (MG63) culture on different implants with cell attachment, morphology and differentiation evaluations. The implant plates were also implanted into the proximal metaphysis of New Zealand White rabbit tibiae. After 8 and 16 weeks implantation, mechanical and histological assessments were performed to evaluate biomechanical and biological behavior in vivo. The results showed that the cell adhesion and cell growth rate on the FHA and HA surface was higher than that on cp Ti surface (p<0.01), and insignificant difference was observed between two coated groups. Mechanical test demonstrated that the FHA implants had a higher interface shear strength than the both controls at 8 and 16 wks, with no significant difference with HA-Ti. Histologically, the coated implants revealed a significantly greater percentage of bone-implant contact when compared with the uncoated implants. Results demonstrated that the new FHA surface improved cell adhesion and proliferation. The coating exhibited a bioactive mechanical and histological behavior at bone-implant interface, suggesting that a useful approach by combined coating processes could optimize implant surfaces for bone deposition and early implant fixation.

Abstract: The interface strength of low-dimensional nano-components such as films and islands formed on substrates has been investigated in this project, and the focus is put on the mechanics of crack initiation from the free interface edge and propagation along the interface. The series of experiments elucidates the applicability of fracture mechanics concept on the structures. We proposed experimental methods for evaluating the initiation strength of an interface crack in submicron films and islands deposited on substrates. The initiation is governed by the singular stress field, and the criterion is prescribed by the stress intensity parameter. Using special loading apparatus built in a TEM, we developed a crack initiation method for nano-components and the role of plasticity on the delamination is clarified. Subcritical crack growth along an interface between submicron films under fatigue was also investigated by modified four-point bend method.

Abstract: The quality of the interfaces in multilayer composites is a critical issue in the reliability testing of the composite product during the manufacturing process and in-service. Weak interfaces have often gone undetected and may become potentially defective at a later stage. One example is the interface between mold compound and silicon (MC/Si) in IC packaging. There is a desire to study the interface quality quantitatively, so the potential defective area can be evaluated and identified early. In this paper, a nondestructive evaluation methodology is proposed to measure the available strength of the interface by using ultrasonic reflection coefficients. It is known that interface degradation can be either due to poor manufacturing process and stress loading. Characterization of the interface quality of the MC/Si interface is first conducted by measuring longitudinal ultrasonic wave reflections from the interface samples fabricated under varying conditioning processes that simulate the degradation. A combined test that measures the reflection coefficient of the interface under stress load has also been conducted to quantify the effect of the load. Finally, it is shown that the overall effect on the reflection coefficient and available strength of the interface is derived and can be used as a quantitative indicator.