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CONFERENCE
12/9/2012 - 12/12/2012
ACAM7: The 7th Australasian Congress on Applied Mechanics
11/16/2012 - 11/18/2012
2nd International Conference on Manufacturing Engineering and Automation (ICMEA2012)
11/16/2012 - 11/18/2012
more...
Articles by keyword: «
Interfacial Reaction
»
67 papers on 5 pages:
1
[2]
[3]
...
[5]
[next]
A Research on Interfacial Reaction of Brazing Joint of Alumina Ceramics to Metals
Published in:
PRICM7
(p2732)
Challenges in Joining Advanced Ceramic Materials: Interface Formation of Ceramic/Metal High-Temperature Brazes
Published in:
New Frontiers of Processing and Engineering in Advanced Materials
(p7)
Corrosion of Nickel-Chromium Alloys by Molton Glass at 1100°C: An Electrochemical Study
Published in:
High Temperature Corrosion and Protection of Materials 4
(p709)
Effect of Heat Treatment on Formation of Columnar Ferrite Structure in Explosively Welded Titanium/Hypoeutectoid Steel Joints
Published in:
Explosion, Shock Wave and Hypervelocity Phenomena in Materials
(p373)
Effect of Interfacial Reaction on High Temperature Properties of Fe-Cr-Si Fiber Reinforced AC8A Aluminum Composites
Published in:
PRICM7
(p2696)
Effect of Mechanoactivation on Interfacial Interaction in Metal/Oxide Systems
Published in:
Diffusion in Solids - Past, Present and Future
(p263)
Effect of RE on Microstructure and Interfacial Reactions of SnAgCu Solder
Published in:
Materials Processing Technologies
(p87)
Effects of Thickness Ratio on Interface Characteristic and Mechanical Properties of Ti/C Laminated Composites
Published in:
Materials Processing Technology
(p1498)
Evaluation of Interfacial Reaction between Titanium Matrix Composites and Aluminium Alloy
Published in:
Advances in Composite Materials and Structures
(p433)
Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging
Published in:
Designing, Processing and Properties of Advanced Engineering Materials
(p893)
Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging
Published in:
Eco-Materials Processing & Design VI
(p273)
High Temperature Interfacial Reaction between Glass Gobs and Sol-Gel Coated Al
2
O
3
Films
Published in:
Advances in Abrasive Technology XII
(p708)
Influence of Content of Ni and Ag on Microstructure and Joint Strength of Lead-Free Solder Joint with Sn-Ag-Cu-Ni-Ge
Published in:
Progresses in Fracture and Strength of Materials and Structures
(p2033)
Interaction between Two Ni-Base Alloys and Oxide Ceramics: SiO
2
, ZrO
2
, HfO
2
, Al
2
O
3
Published in:
High Temperature Corrosion and Protection of Materials 4
(p925)
Interface Reactions and Electrical Properties of Ta/4H-SiC Contacts
Published in:
Silicon Carbide and Related Materials 2006
(p713)
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