Papers by Keyword: Lapping Kinematics

Abstract: In this paper new kinematics systems were studied for a single lapping process. In order to ensure the constant profile wear of the tool a standard kinematic system can be changed. Lapping is carried out by applying loose abrasive grains between two surfaces and causes a relative motion between them. The result is a finish of multi-directional lay. During process, the mechanism of surface formation are decisively affected by a pressure force, a process time and a motion type of grains. It has been proven, that providing the additional movements of the conditioning ring affects the profile wear of the lapping plate. First of all, the kinematics equations of the lapping process have been developed and the process has been simulated. A type of the abrasive particle trajectories in standard single-disk lapping depends on rotational speed ratio of a tool and a conditioning ring. In addition, two new kinematic systems were presented: with radial and secant movement of the conditioning ring. Finally, comparison and analysis of abrasive trajectories were carried out.

Abstract: New tools for flat grinding are the subject of the paper. Electroplated diamond tools with different grains - D64 and D107 - were used in a modified single-disc lapping machine configuration. The results from flat grinding, such as the material removal rate (MMR), surface roughness and plane-parallelism are presented in the paper. Apart from ceramic samples, the additional experiments were carried out on cemented carbide workpieces (H10S) with the use of a diamond electroplated tool (D64). SEM microscopic images of unworn and worn active tool surface are presented with abrasive grains worn by attrition and cavities in the nickel bond after the grains pull out.

Abstract: Previous studies on one-sided lapping allow to state that not only parameters of lapping elements (i.e. properties of workpiece, abrasive grains and lapping plate) impact on a lapping efficiency. Influential are also kinematics and dynamics of the process. It is crucial to control an average velocity of lapping (v), a distribution of tangential acceleration (at), a nominal pressure (p), a lapping time (t) and disposal of workpiece in separator.Based on kinematics equations and the tribological models, the dimensionless distribution of the material removal volume and the trajectories of abrasive grains cutting on the lap were numerically simulated. Obtained information about excessive wear on lapping plate was the starting point to work out non-standard, single-plate lapping systems.In this paper ideas of unconventional lapping systems were presented. After numerous simulations and careful analysis it was observed, that the most desirable system is radial lapping system. It was point out that other systems are not very different from the standard kinematic system. Generated trajectories of an abrasive grain were almost identical. What is more, effects of kinematical parameters on the trajectories, velocities and accelerations observed in radial lapping system are shown.

Abstract: New tools for flat grinding of ceramics (Al₂O₃) are presented in the paper. Electroplated CBN tools (B64 and B107) were used in a modified single-disc lapping machine configuration. The results from experiments, such as the material removal rate and surface roughness parameters are presented and analyzed. Numerical simulations, based on the model for the shape error and tool wear estimation in machining with flat lapping kinematics, are also presented. The tool life of electroplated tools can be extended by choosing appropriate parameter K related to the process kinematics.

Abstract: Lapping of plane surfaces is the technology which allows achieving high surface quality. Kinematics of lapping has the main effect on the flatness of active plane of the lapping tools as well as on the quality and flatness of the machined surface. Lapping machines can be used for grinding without the chuck-related problems as encountered in conventional surface grinding. The configuration of a conventional single-disk lapping machine was modified and the rotational velocity of a workpiece holder can be precisely controlled by a stepper motor. Two types of tools were used for experiments on a modified machine. The first tool was equipped with grinding inserts made of resin and synthetic diamond micrograins (grit size 3/2 m). In the second stage of experiments the single-layer electroplated diamond tool (D107 – grit size 106/90 m) was applied. Ceramic workpieces (Al2O3) were machined on the modified single-disc lapping machine with the use of both tools and with additional loose abrasive. Experimental results of removal rates, technological parameters and kinematical analysis are the subject of the presented paper.