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Articles by keyword: «Lead-Free Solder»

• A Comparative Study of The Fatigue Behavior of SnAgCu and SnPb Solder Joints
  Published in: Advances in Fracture and Strength (p831)
• A New Approach to Calculate Liquid-Vapor Surface Energy Using Sessile Droplet Test
  Published in: PRICM-5 (p2761)
• A Replaceable Lead-Free Solder for Sn-37Pb
  Published in: Information Engineering for Mechanics and Materials (p108)
• An Evaluation of Low-Cycle Fatigue Property for Sn-3.5Ag and Sn-0.7Cu Lead-Free Solders Using Surface Deformation
  Published in: Experimental Mechanics in Nano and Biotechnology (p1035)
• Characterization of Sn-3.5Ag-1.0Cu Lead-Free Solder Prepared via Powder Metallurgy Method
  Published in: Solid State Science and Technology XXVI (p160)
• Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-Free Solder Ball Joints
  Published in: Advances in Fracture and Damage Mechanics VII (p429)
• Damage Constitutive Model and Failure Mechanism of Lead-Free Solder in CBGA Package
  Published in: Materials and Product Technologies (p77)
• Development of Lead-Free Solder Composites Containing Nanosized Hybrid (ZrO₂ + 8 mol.% Y₂O₃) Particulates
  Published in: Science and Technology Hybrid Materials (p59)
• Dislocation Activity and Slip Analysis Contributing to Grain Boundary Sliding and Damage during Thermomechanical Fatigue in Dual Shear Lead-Free Solder Joint Specimens
  Published in: Texture and Anisotropy of Polycrystals II (p219)
• Ductile Damage Evolution Analysis of Lead-Free Sn-Zn Solder Based on Meso Topography
  Published in: New Materials and Advanced Materials (p1004)
• Effect of Ag Content on Mechanical Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Alloy
  Published in: Fracture and Strength of Solids VII (p82)
• Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish
  Published in: Advanced Materials (p1181)
• Effect of Interfacial Reaction in Sn-Ag-Cu Solder Alloy with Ni Addition
  Published in: Fracture and Strength of Solids VII (p247)
• Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization and Sn-3Ag-0.5Cu Solder Ball
  Published in: Fracture and Strength of Solids VII (p849)
• Effect of Isothermal Aging on the Growth and Morphology of the Intermetallic Compounds Formed at the Solder/Cu Interface of the Lead - Free Solder Joint
  Published in: PRICM 6 (p2115)