Papers by Keyword: Low-k Dielectric Materials

Abstract: Carbon nanotube (CNT) interconnects are emerging as the ultimate choice for next generation ultra large scale integrated (ULSI) circuits. Significant progress in precise growth of aligned CNTs and integration of multiwalled CNT interconnects into a test chip make them promising candidates for future nanoelectronic chips. Tremendous research efforts were made on silicon based ultra-low-k dielectrics for Cu interconnects, but, the most recent advancements in polymer based composites as dielectric materials open up fresh challenges in the use of low-k dielectrics for CNT interconnects. This paper reviews the emerging polymer composites like Boron Nitride Nanotubes, Graphene/Polyimide composites, Metal Organic Frameworks and small diameter CNTs. Many reviews are already exists on the synthesis, fabrication, dielectric, mechanical, chemical and thermal properties of these materials. In this review, we have explained the specific properties of these materials and the necessities for integrating them into CNT interconnects to meet the requirements of future IC designers.Keywords: low-k dielectric materials, ultra low-k dielectrics, carbon nanotubes, interconnects, dielectric constant,

Abstract: With low-k dielectric materials taking the place of oxide dielectrics as the primary dielectric materials, the low-k dielectric materials and interconnection Cu metals during Chemical Mechanical Planarization (CMP) is becoming a critical surface quality issue as well. In this study, experiments are carefully designed and conducted to investigate the effects of colloidal silica under compared acidic slurry and self-prepared alkaline slurry on k value of low-k dielectric materials, and in both of the slurry, colloidal silica (20~30nm) was used as polishing abrasive. The results showed that k value of low-k dielectric materials both increased within a similar range (self-prepared alkaline slurry, 3.27~3.33; commercial acidic slurry, 3.26~3.32), however, the results showed a obviously different result from reference’s report.