Papers by Keyword: MCM

Abstract: Orthogonal Frequency Division Multiplexing(OFDM) is going to become the most important technique in the future communication system. The paper presents the principle of OFDM,establishes a simulation model of OFDM communication system based on simulink.By utilizing the system,we briefly analyse the simulation results and conclude the the performance characteristics of OFDM system.

Abstract: A lot of practice had proved that the failure rate can be used as the reliability indicators of MCM (Multi-Chip Module). The lower the junction temperature of the semiconductor integrated circuit device in MCM, the lower the failure rate of components was, thus the higher the reliability of MCM. Therefore, in order to measure the junction temperature of the semiconductor components of MCM, computer simulation is needed in the stage of design，which was essential for improving the reliability of MCM’s encapsulation and even the whole electronic machine system. In this paper, we tried to thermal design the high-power heating devices-MCM of the multi-functional electronic devices. First, the cooling principles of MCM encapsulation were introduced. And then based on the design principles and precautions of MCM, we designed an MCM encapsulation for cooling analyses of ANSYS. The results of finite element analyses showed the reasonableness of the design of MCM, and combined with the different substrate materials and circuit board materials, further discusses about improved cooling capability of MCM were expressed in this paper. At last, we got the desired effect.

Abstract: Internet traffic loads are increasing. Sustaining packet switching throughput of a core node will be difficult. A major reason for this is power consumption and packaging volume. As long as we use only current semiconductor technology, the switching capacity will be limited. Rapid single flux quantum (RSFQ) superconducting technology can overcome such difficulties because of high-speed operation and low-power consumption characteristics. A superconducting wiring also enables high-speed inter-chip communication. We report on progress on packet switch circuit implementation and cryo-cooled packaging for a RSFQ packet switch system. In addition, we discuss a possible packet switch architecture over 100 Tbps that uses RSFQ technology.