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Articles by keyword: «MIS»

• A New Software Design Method Based on Configuration Conception
  Published in: Advances in Materials Manufacturing Science and Technology II (p1088)
• AlON/SiO₂ Stacked Gate Dielectrics for 4H-SiC MIS Devices
  Published in: Silicon Carbide and Related Materials 2008 (p541)
• Analysis and Design of MIS on Graduates Feedback
  Published in: Frontiers of Manufacturing and Design Science II (p3150)
• Characterization of Al-Based High-k Stacked Dielectric Layers Deposited on 4H-SiC by Atomic Layer Deposition
  Published in: Silicon Carbide and Related Materials 2010 (p441)
• Current Collapse Characteristic of AlGaN/GaN MIS-HEMT
  Published in: Silicon Carbide and Related Materials 2007 (p1333)
• Effect of Annealing on Gold Rectifying Contacts in Amorphous Silicon
  Published in: Advanced Materials Forum II (p96)
• Effect of Nuclear Scattering Damage at SiO₂/SiC and Al₂O₃/SiC Interfaces – a Radiation Hardness Study of Dielectrics
  Published in: Silicon Carbide and Related Materials 2011 (p805)
• Electrical Characterization of Deposited and Oxidized Ta₂Si as Dielectric Film for SiC Metal-Insulator-Semiconductor Structures
  Published in: Silicon Carbide and Related Materials 2003 (p845)
• Enhanced Channel Mobility in 4H-SiC MISFETs by Utilizing Deposited SiN/SiO₂ Stack Gate Structures
  Published in: Silicon Carbide and Related Materials 2007 (p679)
• Gallium Nitride Metal-Insulator-Semiconductor Capacitors Using Low-Pressure Chemical Vapor Deposited Oxides
  Published in: Silicon Carbide and Related Materials 2001 (p1535)
• Heteroepitaxial Growth of Insulating AlN on 6H-SiC by MBE
  Published in: Silicon Carbide and Related Materials 2001 (p1457)
• MFC + GE + GPS-Based Old and Valuable Trees Management Information System Design and Research
  Published in: Key Engineering Materials II (p1353)
• MIS Photodiodes of Polymorphous Silicon Deposited at Higher Growth Rates by 27.12 MHz PECVD Discharge
  Published in: Advanced Materials Forum II (p73)
• Nanocrystal Non-Volatile Memory Devices
  Published in: Thin Films and Porous Materials (p1)
• Research and Analysis of MIS System Integrity Based on 3S Technology
  Published in: Advanced Research on Mechanical Engineering, Industry and Manufacturing Engineering (p991)