HOME CONTACT My eBook

Username: Password:

> @scientific.net

Articles by keyword: «Material Removal»

• A Method to Improve Uniformity of Material Removal of Chemical Mechanical Polishing in LCOS Process
  Published in: Optics Design and Precision Manufacturing Technologies (p686)
• An Investigation on the Chemical Effect in Chemo-Mechanical Polishing
  Published in: Advances in Abrasive Technology XIV (p451)
• Analyzing on Nonuniformity of Material Removal in Silicon Wafer CMP Based on Abrasive Movement Trajectories
  Published in: Surface Finishing Technology and Surface Engineering (p119)
• Characteristics of Micro-Precision Machining of Glasses by Powder Blasting
  Published in: Optics Design and Precision Manufacturing Technologies (p897)
• Development in Laser Polishing of Polycrystalline Diamond Tools
  Published in: Surface Finishing Technology and Surface Engineering II (p1)
• Effect of Abrasive Medium Ingredients on Finishing of Al Alloy and Al Alloy/SiC Metal Matrix Composites Using Rotational Abrasive Flow Finishing
  Published in: Mechanical and Aerospace Engineering (p1328)
• Effect of Abrasive on the Machining Performance the EMR-Effect-Based Tiny-Grinding Wheel
  Published in: Surface Finishing Technology and Surface Engineering II (p24)
• Effect of Flexing on Coated Abrasive Belt Grinding of Stainless Steel
  Published in: Advances in Abrasive Technology XIII (p133)
• Effect of Lubricant Volume and Working Gap on the Surface Roughness and Material Removal Rate in Magnetic Abrasive Finishing
  Published in: Diffusion in Solids and Liquids V (p390)
• Effects of the Laser Beam Interaction with the Workpiece Material
  Published in: Material Forming ESAFORM 2012 (p1207)
• Effects of Vibration-Assisted Grinding on Wear Behavior of Vitrified Bond Al₂O₃ Wheel
  Published in: Advances in Abrasive Technology XII (p21)
• Essential Aspects of Chemical Mechanical Planarization for Oxide Semiconductor
  Published in: Precision Machining of Advanced Materials (p1)
• Experiment on Non-Uniformity of Material Removal on Wafer Surface in Wafer CMP
  Published in: Application of Diamond and Related Materials (p187)
• Experimental Investigation during Finishing of Al/SiC-MMC's by Abrasive Flow Machining (AFM) Process
  Published in: Advances in Materials and Processing Technologies II (p1130)
• Experimental Research on Polishing Spot of Bonnet Polishing
  Published in: e-Engineering & Digital Enterprise Technology (p385)