Papers by Keyword: Methicillin-Resistant Staphylococcus aureus (MRSA)

Abstract: Methicillin-resistant Staphylococcus aureus (MRSA) transmission between pigs and humans can be a dangerous infection source for the community. To control and prevent such disease, MRSA research in healthy pigs has been conducted in the US and Holland. This paper reports the first such study in Vietnam. This study aims to optimize the method for investigating MRSA carriage in tonsil and nasal swabs of healthy pigs. Potential samples were selected rapidly by Multiplex PCR (M-PCR) assay with 3 primers (Staph 756, mecA, Sa442) and then combined with conventional methods to detect and pick up MRSA strains. These strains were grouped based on genome pattern by pulsed field gel electrophoresis (PFGE). This study showed that we successfully isolated MRSA and the rate of MRSA carriage samples was 3.63%, much lower than that reported in the USA (49%) and Holland (39%), however the USA and Holland studies investigated pigs from industrial scale piggeries, whereas our study investigated pigs from small farms, which is the usual approach to pig farming in Vietnam. The MRSA patterns identified and associated MRSA strains were different from identified MRSA strains in other countries. This research provides important information about the carriage rate of MRSA in pigs in the Western province of Vietnam and demonstrates the importance of ongoing investigations in this area.

Abstract: Titanium implant surfaces should ideally be designed to promote the attachment of target tissue cells. At the same time they should prevent bacterial adhesion, achievable through specific modification strategies. Copper could be well-suited as an antimicrobial finish, since it combines good antimicrobial properties with a certain bio-tolerance with regard to eukaryotic cells. In the present contribution, we evaluate electrochemical results of antimicrobial titanium surfaces generated by the insertion of copper. The surface was prepared via copper implantation into the titanium subsurface by means of plasma-immersion ion implantation (Cu-PIII) until a depth of about 30 nm. The amount and profile of copper ion implantation was changed by variation of the pulse length which was equivalent to the duty cycles of 0.2 % up to 90 %. Specimens containing 3 – 12 % copper (XPS) were used for electrochemical investigations with the help of the mini cell system in 0.9 % NaCl solution. The change in the shape of cyclic voltammograms demonstrated an alteration of the electrochemical behaviour. Copper oxidation peaks appeared in copper-implanted samples and their height was proportional to the copper concentration. These peaks are related to an electrochemical activity and not suppressed by the superficial titanium oxidation.