Papers by Keyword: Micro Heat Pipe

Abstract: Removal of heat generation is an important characteristic needs to be considered in electromechanical and electronic devices which improve the stability and feasibility of system. Despite numerous cooling methods, heat pipes are recent updating in research line. Heat pipes are one of the super conducting medium of heat energy and it is being used as an equipment to absorb more heat through phase change process of cooling medium circulated in it. It ensures the direct enhancement in heat transfer capacity and characteristics. Nowadays, improvement of the thermal performance in heat pipes getting up with various technologies, especially combination of heat pipe and Nano fluids. It has been experimentally practiced and various results are observed by previous researches that wick structure also a part of reason in improvement. The aim of this research work is to analyze the influence of wick material to improve heat transfer characteristics in heat pipes. In addition, combination of nano coated wick material with heat pipes is comparatively analyzed. From the final observed results it was found that, the best combination of wick material is supporting the better cooling requirements in electronic devices.

Abstract: As an efficient heat conducting unit, micro heat pipe is widely used in high heat flux microelectronic chips, and thermal resistance is one of the factors that are crucial to its heat transfer capacity. Based on heat transfer theory, this paper established a theoretical model of total thermal resistance through analyzing the structure and heat transfer performance of circular heat pipe with trapezium-grooved wick, simplified the model and tested the micro heat pipe for its total thermal resistance performance by setting up a testing platform. The testing results show that when the micro heat pipe is in the optimal heat transfer state, its total thermal resistance well coincides with that from the established theoretical model. As for a micro heat pipe with trapezium-grooved wick, its total thermal resistance first decreases, then increases with heat transfer capability increment, and reaches the minimum when it is in the optimal state of heat transfer performance. That too much working fluid accumulates in evaporation section and the vapor velocity is rather low is the main cause for the greater thermal resistance when the pipe is in low heat transfer quantity, yet the greater total thermal resistance when the pipe is in high heat transfer quantity is mainly caused by the working fluid drying up in condensation section. The total thermal resistance is related to many factors, such as the thermal conductivity of tube-shell material, wall thickness, wick thickness, the number of the grooves, the lengths of condensation and evaporation sections, the diameter of vapor cavity etc.. Therefore, the structure parameters of a micro heat pipe with trapezium-grooved wick should be rationally designed according to specific conditions to ensure its heat transfer capacity and total thermal resistance to meet the requirements and be in the optimal state.

Abstract: As a highly efficient heat dissipation unit, a micro heat pipe is widely used in high heat flux microelectronic chips, and its thermal resistance is crucial to heat transfer capacity. Through analyses of the structure and heat transfer performance of a circular heat pipe with sintered wick, the theoretical model of total thermal resistance was established on heat transfer theory, and then simplified, finally a testing platform was set up to test for total thermal resistance performance. The testing results show that when the micro heat pipe is in optimal heat transfer state, its total thermal resistance conform well with that from the theoretical model, and its actual thermal resistance is much lower than that of the rod made of the material with perfect thermal conductivity and of the same geometric size. With the increment of heat transfer capability, the total thermal resistance of a micro heat pipe with sintered wick decreases first, then increases and reaches the minimum when it is in the optimal heat transfer state. The greater total thermal resistance in low heat transfer performance is mainly caused by too much working fluid accumulating in evaporator and the lower velocity in vapor cavity, and the greater total thermal resistance in high heat transfer performance is mainly due to the working fluid drying up in condenser. Total thermal resistance is related to many factors, such as thermal conductivity of tube-shell material, wall thickness, wick thickness, copper powders grain size and porosity, the lengths of condenser and evaporator, and the diameter of vapor cavity etc.. Therefore, the structure parameters of a micro heat pipe with sintered wick should be reasonably designed according to the specific conditions to ensure its heat transfer capacity and total thermal resistance to meet the requirements.

Abstract: This paper has built a mathematical model for the evaporating characteristics of the grooved micro heat pipe’s thin film region and computed them in a specific working condition. The evaporating model of Wayner was employed in this mathematical model. The results from computation showed, for the H2O and NH3 as working fluid, at the beginning of the thin film region, the heat flux raised rapidly to a peak value and then declined to almost 0 also rapidly in a very short distance. Differently, for the Na and K as working fluid, the heat flux raised quickly but declined slower. Therefore, the alkali metals working fluids had larger area of high heat flux covered. The results indicated that the alkali metals working fluid has better evaporating characteristics for the high-temperature heat pipe than normal working fluids.

Abstract: High-power LED street-lighting with advantages including long lifespan, great luminescent efficiency, lower power consumption and superior environmental performance has received more and more attention. However, the lifespan of corresponding LED drivers fails to match with that of LEDs. The main reason is that in tight and confined spaces, high heat flux cannot be emitted to surroundings, which lead to the increased temperature of electric devices in LED driver. In this paper, high conductive micro heat pipes (MHPs) are applied in the cooling system. Firstly, the Icepak thermal simulation software is applied in analog contours of temperature of interior driver. Then experiments are carried out to measure the temperature of electric devices of LED driver. The results indicate that internal temperature of LED driver is decreased by 5°C when MHP is applied, compared with the original thermal design. The capacitor and MOSFET which are sensitive to heat and easy to damage run under optimized temperature.

Abstract: For great progress in heat pipe technology, a micro heat pipe has become an ideal heat dissipating device in high heat-flux electronic products, and capillary limit is the main factor affecting its heat transfer performance. Based on analyses of capillary limit and currently commonly-used groove structures, this paper built capillary limit models for micro heat pipes with dovetail-groove, rectangular-groove, trapezoidal-groove and V-groove wick structures respectively for theoretical analyses. The analysis results show that better heat transfer performances can be obtained in micro heat pipes with small-angle dovetail (i.e. a sector structure), rectangular and small-angle trapezoidal grooved wick structures when groove depth is 0.2-0.3mm and top-width-to-depth ratio is 1.2-1.5.

Abstract: With heat flux increasing and cooling space decreasing in microelectronic and chemical products, micro heat pipe has become an ideal heat dissipation device in high heat-flux products. Through the analysis of its working principle, the factors that affect its heat transfer limits and the patterns in which copper powders are arrayed in circular cavity, this paper first established a mathematical model for the crucial factors in affecting heat transfer limits in a circular micro heat pipe with a sintered wick, i.e. a theoretical model for capillary limit, and then verified its validity through experimental investigations. The study lays a powerful theoretical foundation for designing and manufacturing circular micro heat pipes with sintered wicks.

Abstract: In this paper, a kind of one-dimensional steady-state model is used to analyze and simulate the capillary motion of the working material in micro heat pipe. The character of this model is that it includes the influence of the interface friction, and the influence of the friction to the micro heat pipe’s performance is also simulated and analyzed. The maximum heat transport capacity and the optimizing size of the grooves are calculated by this model. Some experiments have been carried out to evaluate the simulation results.

Abstract: A kind of flat micro heat pipe with glass fiber wick structure is designed and fabricated. The structure of the wick is presented and also the excellence of the structure is described. For the glass fiber wick, the maximum heat transports is calculated by one-dimensional steady governing equations. Experimental testing is performed for the fabricated micro heat pipe in vacuum. The testing results is presented and analyzed.

Abstract: A three-dimensional mathematical model is developed for a kind of micro heat pipe with fiber wick. The effects of phase changing, the contact angle, gravity, and heat conducting between the fibers are accounted in the model. The governing equations are formulated in the control volume and calculated by iteration. The calculated results of the model present the velocity of the working material and the phase changing rate of the liquid. The structure of the micro heat pipe is optimized by the calculated results of the model and the two levels of fibers are enough for this kind of flat micro heat pipe.