A Review of Test Structures for Characterising Microelectronic and MEMS Technology

Authors: Anthony J. Walton, Stewart Smith

Application and Prospects of Packaging Technology of MEMS

Authors: Xian Zhang Feng, Liang Ji Chen, Jun Wei Cheng

Direct and Indirect Strain Measurement of Flexible Printed Circuit Boards - fPCBs

Authors: Luciano Arruda, Cristiano Coimbra, João Marco Andolfatto

Hydrogen-Dopant Interactins in Crystalline Semiconductors

Authors: Jacques Chevallier

Internal Stresses in Aluminium Interconnects

Authors: A. Saerens, Paul van Houtte, A. Witvrouw

Microelectronics Package Design Using Experimentally-Validated Modeling and Simulation

Authors: Nathan Young, Jay Johnson, Kevin G. Ewsuk

Modeling Delamination of Interfacial Corner Cracks in Multilayered Structures

Authors: Badrinath Veluri, Henrik Myhre Jensen

Processing and Properties of Cu Matrix Composites for Microelectronic Application

Authors: Yong Jin Kim, Jung Ho Ahn, Hyung Sik Chung

Recent Advances in Thick Films

Authors: Obrad S. Aleksić

Self-Formation of the Artificial Planar Systems. What is It?

Authors: Stepas Janušonis