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Articles by keyword: «Microelectronics»

• A Review of Test Structures for Characterising Microelectronic and MEMS Technology
  Published in: Smart Materials & Micro/Nanosystems (p356)
• Application and Prospects of Packaging Technology of MEMS
  Published in: Components, Packaging and Manufacturing Technology (p274)
• Hydrogen-Dopant Interactins in Crystalline Semiconductors
  Published in: Defect and Diffusion Forum Vols. 131-132 (p9)
• Internal Stresses in Aluminium Interconnects
  Published in: Residual Stress ECRS 5 (p556)
• Microelectronics Package Design Using Experimentally-Validated Modeling and Simulation
  Published in: Advanced Engineering Ceramics and Composites (p192)
• Processing and Properties of Cu Matrix Composites for Microelectronic Application
  Published in: THERMEC'2003 (p2199)
• Recent Advances in Thick Films
  Published in: Advanced Materials for High Technology Applications (p65)
• Self-Formation of the Artificial Planar Systems. What is It?
  Published in: Self-Formation Theory and Applications (p11)
• Silicon Based Heterostructures: Advances in Channel Materials
  Published in: Advances in Electronic Materials (p27)
• Silicon Wafer Technology. Status and Overlook at the Millennium and a Decade Beyond
  Published in: Gettering and Defect Engineering in Semiconductor Technology VIII (p1)
• Today’s Mainstream Microelectronics - A Result of Technological, Market and Human Enterprise
  Published in: Advances in Electronic Materials (p1)
• Ultrasonic Friction Power in Microelectronic Wire Bonding
  Published in: THERMEC 2006 (p3920)
• X-Ray Diffraction Determination of Residual Stresses in Narrow Copper Interconnects with Submicronic Widths
  Published in: Residual Stress ECRS 5 (p562)