Keyword:
"Microelectronics"
| Paper Title |
Page |
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A Review of Test Structures for Characterising Microelectronic and MEMS Technology
Authors: Anthony J. Walton, Stewart Smith
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356
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Application and Prospects of Packaging Technology of MEMS
Authors: Xian Zhang Feng, Liang Ji Chen, Jun Wei Cheng
|
274
|
|
Direct and Indirect Strain Measurement of Flexible Printed Circuit Boards - fPCBs
Authors: Luciano Arruda, Cristiano Coimbra, João Marco Andolfatto
|
88
|
|
Hydrogen-Dopant Interactins in Crystalline Semiconductors
Authors: Jacques Chevallier
|
9
|
|
Internal Stresses in Aluminium Interconnects
Authors: A. Saerens, Paul van Houtte, A. Witvrouw
|
556
|
|
Microelectronics Package Design Using Experimentally-Validated Modeling and Simulation
Authors: Nathan Young, Jay Johnson, Kevin G. Ewsuk
|
192
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Modeling Delamination of Interfacial Corner Cracks in Multilayered Structures
Authors: Badrinath Veluri, Henrik Myhre Jensen
|
509
|
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Processing and Properties of Cu Matrix Composites for Microelectronic Application
Authors: Yong Jin Kim, Jung Ho Ahn, Hyung Sik Chung
|
2199
|
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Recent Advances in Thick Films
Authors: Obrad S. Aleksić
|
65
|
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Self-Formation of the Artificial Planar Systems. What is It?
Authors: Stepas Janušonis
|
11
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Showing 1 to 10 of 15 Papers