Papers by Keyword: Microstress

Abstract: Composite character of ceramics is a base for creating new generation materials. It is established that the rational choice of the basic structural elements allows to control stress-strain state of the "loaded" ceramics and to slow down process of its degradation. The developed method of designing of details taking into account ceramics degradation at exploitation is described.

Abstract: The elastic-plastic finite element mechanical model of hypereutectic Al-Si alloy was established based on ANSYS software. When the Si particles were circle, trapezium, rectangle or triangle, the microstress of Al-Si alloy under the external load were simulated. When the size of Si particles changed from 25μm to 45μm, the stress of Si particles and matrix interface was calculated. The effects of morphology and size of Si particles and loads on micro-mechanics characteristic of alloy were analyzed. The results showed that: under the same load, triangle or wedge angle Si particles make the biggest stress in the matrix, trapezoidal particles make the second and the spherical particles make the smallest. With the increase of the load, the stress and the stress concentration of Si particles in the matrix was increased, the stress of wedge angle particle increases remarkably, but the stress of spherical particles increases slowly. With the increase of the size of Si particles, the stress and the stress concentration of Si particles in matrix are increased.

Abstract: The research of micromechanism of stress evolvement is presented by analyzing fluctuation and change of surface stress in aluminum alloy thick plate with X-ray diffraction(XRD). From the micro view, a model of “rotation looping and shearing grain” was proposed to analyze and discuss the inhomogeneous distribution of micro-stress in location area, due to inhomogeneity of organization in material. The results present that the inhomogeneity of plastic deformation is direct cause lead to residual stress in plate, and complication of micro-stress distribution results from non-uniformity of organization.

Abstract: A range of different spraying techniques can be used to coat the surfaces of engineering components. These techniques are based on different principles and can involve high temperature (plasma spray), high kinetic energy (cold spray) or both (HVOF spray – High-Velocity Oxi-Fuel). Resultant residual stress in such coatings, being a characteristic of the spraying process, can reveal details of the stress formation mechanism. When its dependence on the physical parameters and conditions of the spraying process is established, this knowledge can be used for the prediction and control of stress that occurs in applications. Neutron diffraction is a suitable method for obtaining stress distribution in such coatings. Residual stresses in two-phase Cu+W coatings made by water stabilized plasma spraying were studied. Two-phase coatings develop both significant microstress (inter-phase stress) and the stress dependence on phase content of the coating constituents. Through-thickness residual stress profiles have been measured by neutron diffraction with spatial resolution of 0.5 mm for a series of Cu+W coatings with varying volume fractions. Measurements were made in both phases in order to separate micro- and macro-stresses. Comprehensive sample characterization, measurements of the residual stresses, mechanical and thermal properties of the composite coatings enabled quantitative modeling and interpretation of the experimental data.

Abstract: Journal bearings are graded systems with a metal-metal composite as the functional layer. Estimation of the microscale stress distributions is used to analyse the interaction between microstructure, material properties and damage mechanisms during wear. The analysis is executed by means of simple plane-strain finite element models mimicking experimentally observed microstructures. It is found that under realistic macrosstress conditions no tensile microstresses are induced in the triboalloy and that plastic flow is inhibited by the graded structure.

Abstract: Thin films of molybdenum nitride (MoNx with 0≤x≤0.35) were deposited on Si(100) at room temperature using reactive DC magnetron sputtering. The residual stress of films was measured as a function of sputtering pressure, nitrogen incorporation, and annealing temperature by wafer curvature-based technique. It was found that the stress of the films was strongly related to their microstructure, which depended mainly on the incorporation of nitrogen in the films. The film stresses without nitrogen addition strongly depended on the argon pressure and changed from highly compressive to highly tensile in a relatively narrow pressure range of 0.8-1.6 Pa. For pressures exceeding ~5.3 Pa, the stress in the film was nearly zero. Cross-sectional transmission electron microscopy indicated that the compressively stressed films contained a dense microstructure without any columns, while the films having tensile stress had a very columnar microstructure. High sputtering-gas pressure conditions yielded dendritic-like film growth, resulting in complete relaxation of the residual tensile stresses. It was also found that the asdeposited film was poorly ordered in structure. When the film was heated at ~775 K, crystallization occurred and the stress of the film drastically changed from –0.75 to 1.65 GPa. The stress development mechanism may be due to volumetric shrinkage of the film during crystallization.