Papers by Keyword: Misfit Dislocation

Abstract: First relaxation stages in Si1-x Gex layers on Si substrates are induced by annealing of metastable, low-temperature buffer layer samples and observed by X-ray topography (XRT). This method allows observing large area (several square millimetres) of a sample and reveals very low densities of defects, located in the layer as well as in the substrate. It allow to follow the evolution of the very first steps of the relaxation, starting with dislocation crosses which were characterized and evolving to misfit dislocation network by very low increases of thermal budget. It is proposed a nucleation mechanism of these crosses based on Frank loops due to point defects condensation which can transform locally in glide dislocations under the influence of the biaxial stress in the film.

Abstract: The precipitation processes from G.P. zones to γ’ in a Cu−0.9wt%Be alloy single crystal containing only the G.P. zones parallel to the matrix (001)α plane are investigated by high-resolution electron microscopy. The precipitate phases follow a G.P. zone → γ” → γI + γ’ sequence. The G.P. zone to γI phase transformation occurs successively via γ” during aging, while the γ’ phase heterogeneously precipitates on the γI phase. From length-change measurements during aging, the misfit strains of γ’ precipitates in directions perpendicular and parallel to [001]α are estimated as ε11 =ε22 = −0.03 and ε33 = −0.09, respectively. The observation that the estimated absolute value of ε33 is much smaller than that of ε33 = −0.25 calculated using lattice parameters of the γ’ phase and Cu matrix is understood in terms of the relaxation of ε33 by interfacial misfit dislocations.

Abstract: By using molecular dynamics simulation, misfit dislocation networks are made on semi-coherent interfaces in a laminate structure of Ni and Ni3Al single crystals. The core structure of the networks is discussed in detail, focusing on the different atomic configuration at the interfaces; e.g. with or without Al atoms on the Ni3Al side. It is revealed that the networks can be a source of partial dislocation loops under the external loading; however, the loops tend to form immobile wedge-like stacking faults, analogous to the stacking fault tetrahedron (SFT), near the interface with Al atoms. On the other hand, the loops propagate into both Ni and Ni3Al phases, from the network dislocations on the interface without Al atoms.

Abstract: Strain adjustment is obtained by virtual substrates which are composed of a silicon substrate and a strain relaxed buffer. The basics of strain relaxation are explained and applied to the covalent bonded Si/Ge system which shows a large regime of metastability. A solution to ultrathin strain relaxed buffers is given by the injection of point defects which nucleate to dislocation loops in the interface. Principle and injection mechanism are shown.

Abstract: An overview is given of analytical techniques for the characterization of the electrical and transport parameters in thin (<1 µm) semiconductor layers. Some of these methods have been applied to the lifetime and diffusion length study in thin strain-relaxed buffer (SRB) layers of strained silicon (SSi) substrates, while a second group was dedicated to Silicon-on-Insulator (SOI) materials and devices. The employed techniques can be divided into two groups, whether a device structure (junction, MOS capacitor, MOSFET) is required or not. However, the MicroWave Absorption (MWA) technique can be used in both cases, making it a versatile tool to study both grown-in and processing-induced electrically active defects. The transport properties of SSi wafers are strongly determined by the density of threading and misfit dislocations, although the dependence of the recombination lifetime is weaker than expected from simple Shockley-Read-Hall (SRH) theory. This is related to the high injection regime typically employed, enabling the characterization of the 250-350 nm thick Si1-xGex layer only. At longer carrier decay times, multiple trapping events dominate that can be described by a stretched exponent approach, typical of disordered materials. For SOI substrates, transistor-based techniques will be demonstrated that enable to assess the generation or recombination lifetime in the thin silicon film (<100 nm). The lifetime can be severely degraded by irradiation or hot-carrier degradation. Finally, it will be shown that Generation-Recombination (GR) noise spectroscopy as a function of temperature allows identifying residual ion-implantation-damage related deep levels, which are otherwise hard to detect even by Deep Level Transient Spectroscopy (DLTS).

Abstract: We present experimental data on the effect of low-temperature buffer layers on the dislocation structure formation in SiGe/Si strained-layer heterostructures under thermal annealing. Specific subjects include mechanisms of misfit dislocation nucleation, propagation and multiplication as well as the role of intrinsic point defects in these processes. Samples with lowtemperature Si (400°C) and SiGe (250°C) buffer layers were grown by MBE. In general, the processes of MD generation occur similarly in the heterostructures studied independently of the alloy composition (Ge content: 0.15, 0.30) and kind of buffer layer. Intrinsic point defects related to the low-temperature epitaxial growth influence mainly the rate of misfit dislocation nucleation.

Abstract: The electrical activity of threading dislocations (TDs), occurring in a thin SiGe Strain Relaxed Buffer (SRB) layer has been investigated by a number of techniques and its impact on the reverse current of p-n junction diodes has been evaluated. It is shown that besides the density of TD, there are at least two other parameters playing an important role. The distance with respect to the metallurgical junction of the 5 nm C-rich layer, used for the strain relaxation and the dopant type in the well region also affect the leakage current. This complex behaviour is further reflected in the Emission Microscopy (EMMI) images, showing different breakdown sites for p+/n or n+/p junctions. Results will be presented whereby one of these parameters is varied, while the others are kept constant, in order to arrive at some idea of the relative importance of the different factors.