Papers by Keyword: Optimal Condition

Abstract: The progress of adsorption capacity-enhancing modified manganese mineral, as well as the optimal conditions on which the adsorption of modified natural manganese mineral is conducted, are discussed and summarized in this paper. Moreover, the optimal parameters of the adsorption of Cu2+, Ni2+, and As (V) by using natural manganese mineral are respectively presented and the adsorption capacity is compared.

Abstract: The copper-bearing ore assays 1.7g/t Au, 50.43% Fe and 0.41% Cu. Recovered gold by cyanide leaching, in this study, the orthogonal test design was used to examine effects of NaCN dosage, leaching time, agitation intensity, particle size on gold leaching rate and determine the optimal operation combination for the purpose of increasing gold recovery. Gold extractions of 92.34% were achieved using a particle size of 90%-200 mesh, NaCN dosage of 1.8kg/t, leaching time of 36h and agitation rate of 400r/min.

Abstract: It is important to obtain the optimal condition in wafer polishing processing. Polishing is one of the most important methods in manufacturing of Si wafers and in thinning of completed device wafer. This study will report the evaluation on abrasion of wafer according to processing time; machining speed and pressure which have the major influence on the abrasion of Si wafer polishing, for this, this study design the head unit and analysis head unit. After that, this study applies to experiment. The evaluation of abrasion according to processing condition is selected to use result data that measure a pressure, machining speed, and the processing time. This result is appeared by machining condition. Through that, the study can evaluate the abrasion characteristic of wafer in machining.