Papers by Keyword: PVT

Abstract: The modified design using an air-pocket existing on inside of crucible has been proposed for the growth of 6-inch SiC single crystal. The actual growth has been performed for conventional, focus ring design and modified hot-zone designs under the same growth conditions and then three SiC crystals were systematically compared in terms of crystal quality. Since stacking faults and polytype inclusions, which could cause dislocation formation, were suppressed by the suitable C/Si ratio control, it was possible to grow SiC ingots with reduced defect density and excellent crystal quality with crucible structures proposed in this study.

Abstract: A new method for reducing the cost and the fabrication time of source material required for SiC crystal growth has been proposed through a heat treatment of recycled powder bulk in this study. The actual crystal growth with using a conventional powder and a recycled powder bulk source has been performed under identical growth condition and then systematically compared in terms of the crystal quality. With applying the recycled powder bulk for SiC crystal growth, similar growth results were obtained as a result grown by conventional high-purity powder source. In terms of crystal defects, slight improvement was observed when high purity recycled powder bulk source was applied.

Abstract: A detailed knowledge of the growth front geometry during physical vapor transport (PVT) growth of SiC single crystals is beneficial to achieve high quality n+ SiC substrates for power device applications. In this report we show how mapping of resistivity in SiC wafers can shed light on local growth conditions, which are very difficult-to-study in situ. We consider both thermodynamic quantities (absolute temperature T and partial pressure p_N₂) and geometric characteristics of the growth surface relevant to growth kinetic parameters, namely atomic terrace width and atomic step velocity. Specifically, we show how an elevation map of the growth surface can be reconstructed from a spatially-resolved measurement of resistivity in a SiC wafer by integrating the spatial derivative of elevation with respect to the basal plane, which is assumed to be related to local resistivity through dependence of non-equilibrium nitrogen incorporation on the atomic step velocity.

Abstract: To better understand the effects of various growth parameters during the early-stages of PVT growth of 4H-SiC on resulting defect structures, multiple short duration growths have been carried out under varying conditions of seed quality, nucleation rate, thermal gradients, and N incorporation. Besides the replication of TSDs/TMDs and TEDs as well as the deflection of TSDs/TMDs into Frank dislocations, synchrotron monochromatic beam x-ray topography (SMBXT) studies also reveal the formation of stacking faults bounded by Frank dislocations. Using ray tracing simulations to characterize the Frank dislocations, three types of stacking faults are revealed: Type 1 stacking fault resulting from 2D nucleation of 6H polytype on terraces; Type 2 stacking fault resulting from macrostep overgrowth of the surface growth spiral steps of TSDs/TMDs which separate into c/2 or c/4 increments; Type 3 stacking fault resulting from vicinal step overgrowth of surface growth spiral steps of TSDs/TMDs which separate into c/4 and 3c/4 increments. Analysis of atomic resolution scanning transmission electron microscopy (STEM) images reveals the mechanism of the Type 3 fault.

Abstract: The aim of this study is to show the applicability of continuous residual gas analysis for growth monitoring of undoped SiC with physical vapor transport (PVT). For this purpose, two crystals were grown, one without doping and one with continuous nitrogen doping. During the processes continuous residual gas analysis were conducted and evaluated with emphasis on the temporal variations of the nitrogen content. The charge carrier concentration of the final crystals was determined by optical methods (spectrally resolved absorption measurement with UV-VIS and Raman spectroscopy) and the results were compared with the residual gas analysis during growth. A correlation was found between the measured nitrogen-related signal and the charge carrier concentration in the samples.

Abstract: Due to high growth temperatures during the physical vapor transport (PVT) it is still almost impossible to gain proper insight into the actual growth conditions. Therefore, computer tomography (CT) is used as an in-situ monitoring during the crystal growth process. With the help of this technique, it is possible to observe the nucleation centers during the initial stage of growth (CT after 0h) of a 4H-SiC single crystal. These growth islands are likely built before the actual growth conditions are reached. Raman investigations of the area around a growth island located directly on the interface between seed and grown crystal is used to support this assumption. In addition, optical analysis after KOH etching were made to reveal the defects around the growth island. The island exhibits a rough doping concentration in comparison to the surrounding grown crystal.

Abstract: The hot-zone design using an air-pocket was adopted to produce uniform temperature gradient in horizontal direction. In order to investigate the change of temperature gradient toward horizontal direction with growth time, the front shape of SiC growing crystal was measured with different growth stages such as initial, growing and finished stage. While SiC ingot grown in conventional hot-zone design exhibited inhomogeneous growth front in the initial stage of growth and multi facet formation in final stage, which could result in increased defect density, a homogeneous temperature gradient and improved crystal quality was obtained in the modified hot-zone design. Based on the mapping measurement of FWHM (Full width at half maximum) value in X-ray rocking curve, the crystal quality of SiC crystals grown with the modified hot-zone design was observed to be definitely better than conventional design.

Abstract: Tantalum carbide (TaC) coating, produced in an ultrahigh temperature chemical vapor deposition (CVD) process, exhibited high thermal and chemical stabilities, low emissivity, and high purity. Low emissivity of 0.3~0.43 was measured on TaC coating at 1000°C and compared with the one of SiC coating. As revealed in both simulation and experiment, the low emissivity of TaC coatings not only improves temperature uniformity in the SiC PVT process, but also reduces power consumption in both SiC crystal growth and GaN epitaxial deposition. The results provide important guidance to process tuning when switching from a conventional graphite or SiC-coated component to its TaC-coated counterpart.

Abstract: The growth conditions of 75 mm SiC crystals in the PVT process is varied by different methods while the temperature field is kept constant. The addition of graphite into the source material leads to the formation of an ordered step flow with step heights of 0.014 µm, while the addition of graphite into the source together with N₂ doping changes the step kinetics on the main facet, leading to very large, bunched steps of 0.17 µm. When elemental Si was added into the source material large macro steps are formed on the whole crystal surface. While the doping induced step bunching is related to the incorporation kinetics, the large steps induced in Si-rich conditions are attributed the reduction of surface energy. With the variation of the inert gas pressure the morphology of the surface is altered, similarly. Under low pressure conditions (0.2 mbar) a fine step structure evolves, while at a high pressure (40mbar) large surface steps are formed on the whole growth interface. Large surface steps are strongly impeded in their lateral motion at defects permeating the growth interface. At these sites the formation of foreign polytypes is facilitated.

Abstract: Different initial process steps during PVT crystal growth of SiC were monitored with a mass spectrometer. To measure the gas phase composition in the PVT growth machine during these steps the continuously pumped exhaust gas was analyzed by a quadrupole mass spectrometer (PrismaPro QMG 250). In order to reduce unintentionally doping of the crystal by contaminations in the growth setup the focus was on the release of nitrogen during the initial steps of the growth process. During the heat up of the growth setup in vacuum a substantial release of molecular nitrogen was observed at 800 °C. Further, the influence of pump and purge-steps on the amount of nitrogen in the gas phase was examined. After performing a pump and purge step, the intensity of the measurable nitrogen-related signal (m/z = 28) was approximately 20 % of the initial value. In-situ monitoring of the gas phase during the initial steps of crystal growth proved to be a versatile tool for the development of a process minimizing unintentionally doping through released nitrogen.