Papers by Keyword: Package

Abstract: The article is devoted to the study of the kinetics of packet formation and energy distribution in the process of explosion welding. The results of experimental determination of the components of the total energy balance during explosion welding and their influence on obtaining a given part profile are presented. The kinetics of the package motion during explosion welding with simultaneous formation of a bimetallic billet with a cylindrical profile is shown.

Abstract: Survey objective: development of methods for manufacture of combined packaging materials containing volatile corrosion inhibitors (VCIs) and estimation of their corrosion resistance. The investigation outcome includes prototypes of the combined packaging material containing VCIs, developed optimal paper manufacturing design parameters, estimation of their protective properties compared with those of foreign equivalents. Based on the investigation outcome, the following optimal concentrations of inhibitor work solutions are selected to provide protective properties of the obtained materials: 4 mass. % in water solution for VCI-1 and VCI-2; 10 vol. % in nefras for VCI-3. It was found that inhibitor work solutions might be preferably applied on the base paper with a roller because of a low viscosity of inhibitor work solutions and even the inhibitor application obtainable with this method. The optimum temperature value for drying of the combined packaging material is 80 oС because it virtually does not result in change of inhibitor residuals. Tests according to GOST 9.054-75 prove the corrosion-resistive efficiency of the combined packaging materials obtained. Estimation of corrosion-resistive properties of the studied materials has also established that paper covered with VCI-2 is of a universal character as it features high protective properties related to cold and hot-rolled steels. Corrosion inhibiting properties of test samples of combined materials with VCI-1 and VCI-2 are equal to those of foreign equivalents.

Abstract: A digital CMOS output interface circuit is proposed, which lowers down the peak and lengthen the duration of the pulse of current supplied by the power supply to reduce the SSN (simultaneously-switching noise) effects. The simulation shows that the maximal SSN voltage of the proposed circuit is 331.5mV compared to 662.4mV of the traditional one.

Abstract: A new green packaging material—honeycomb board was studied. Several main technical parameters were tested and some advice was put forward on development of honeycomb board.

Abstract: The SPI was applied in food industry widely, but its functionalities may change during storage. The effect of store temperature, time, RH and package material on emulsibility and the component of SPI were studied, when SPI was packaged in 100% N2 and Al, 80%N2:20%CO2 and Al, 60%N2:40% CO2 and Al, vacuum and Al, white paper/plastic/HDPE, and PE and then stored for 5 months in the conditions of RH 80% and 30°C. It was observed by SDS-PAGE that the subunit of SPI disaggregated and molecules aggregated. Comparing the functionalities of SPI with different packaging material, it was shown that the sequence of the barrier property of material to T and RH was Al packaging>factory packaging>PE packaging. Analyzed by relatedness, it was shown that the 7S/11S of SPI with PE packaging storage was not significant with emulsibility. The content of -SH with PE was significantly positive with emulsibility (EAI 0.975**/ESI 0.985**), but the -S-S- of SPI in PE was significantly negative (EAI -0.975**/ESI -0.967**) correlation with emulsibility.

Abstract: The SPI was applied in food industry widely, but its functionalities may change during storage. The effect of store temperature, time, RH and package material on emulsibility and the component of SPI were studied, when SPI was packaged in 100% N2 and Al, 80%N2:20%CO2 and Al, 60%N2:40% CO2 and Al, vacuum and Al, white paper/plastic/HDPE, and PE and then stored for 5 months in the conditions of RH 80% and 30°C. It was shown that the 7S/11S of SPI only packaged in PE decreased significantly(p<0.05), while the subunit of SPI would lost in different levels and obviously in PE. It was observed by SDS-PAGE that the subunit of SPI disaggregated and molecules aggregated. Focusing on the sulfydryl group and disulfide bond, it was found that the content of sulfydryl decreased while disulfide bond increased.

Abstract: This paper describes the fabrication process of the thin film bulk acoustic resonator (FBAR) based on good quality aluminum nitride (AlN) film and the measurement of FBAR by a network analyzer. The AlN film with a highly c-axis orientation and homogeneous surface morphologies is deposited on Bragg reflectors as piezoelectric film by magnetron sputtering. The Bragg reflectors consisted of Ti and W fabricated under the resonator for acoustic isolation improves performance and compatibility of the FBAR and reduces the parasitic resistance of the electrode. The devices are packaged on tube seat and fixed on a high frequency PCB board designed specially for measurement and applications. The FBAR achieved a Q factor of 505 and k²_eff of 3.42% at a resonant frequency of 2.22 GHz. A high sensitivity of 4.79 kHz·cm²/ng is obtained in the FBAR, which is higher than quartz crystal microbalance.

Abstract: IGBT is the important component of electric vehicle. According to the characteristics of IGBT module in electric vehicle, this article introduces the package design of a high power IGBT module. The feature of the scheme is analyzed from the aspects of power chip, substrate, power electrode, control electrode and epoxy resin layer. Experimental results of the sample show the design meets the qualification.

Abstract: A partially electrically isolated package with a gold wire and fully isolated solution with a metallic piston, respectively, are designed and tested for high temperature sensors (400°C) based on SiC Schottky barrier diodes (SBD). Electrical behavior and sensor performance are very close for both packaging solutions. The stress due to contact pressure and higher cost are some disadvantages for pressure contact technology.

Abstract: Simulation technology provides a powerful tool for the package design. Parasitic are one of the most important factors for press pack IGBT. By the aid of the simulation software, the package parasitic is extracted and the current distribution among paralleled chips is analyzed. Simulation results confirm the theoretical analysis and verify the efficacy of the new approach.