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CONFERENCE
6/16/2013 - 6/19/2013
The 7th International conference on Physical and Numerical Simulation of Materials Processing
5/16/2013 - 5/19/2013
2nd International Congress on Advanced Materials
4/13/2013 - 4/14/2013
2013 2nd lnternational Conference on lntclligent Materials, Applied Mechanics and Design Science (IMAMD 2013)
more...
Articles by keyword: «
Packaging
»
36 papers on 3 pages:
1
[2]
[3]
[next]
A Novel Silicon-Based Packaging Platform for High-Efficiency LED Modules
Published in:
Advanced Manufacturing Technology
(p359)
A Research on Simplifying Packaging Design
Published in:
Natural Resources and Sustainable Development II
(p836)
Al/Ni Self-Propagating Exothermic Film for MEMS Application
Published in:
THERMEC 2009
(p2142)
Ceramic Packaging for Electronics
Published in:
Advanced Ceramic Materials
(p17)
Crack-Less Wafer-Level Packaging Using Flash Heating Technique for Micro Devices
Published in:
THERMEC 2011
(p1979)
Design and Research of Sewing Tube Packing Device Based on Pneumatic
Published in:
Mechanical Engineering, Materials and Energy
(p632)
Design and Simulation for a Carton Packaging Robot
Published in:
Frontiers of Manufacturing and Design Science
(p2011)
Design of the Automated Packaging Systems with the Phthalic Anhydride Products
Published in:
Frontiers of Manufacturing Science and Measuring Technology II
(p140)
Development of the Research on High-Power WLEDs
Published in:
Powder Technology and Application III
(p42)
Electrical and Thermal Performance of 1200 V, 100 A, 200°C 4H-SiC MOSFET-Based Power Switch Modules
Published in:
Silicon Carbide and Related Materials 2009
(p1119)
Embroidered Interconnections and Encapsulation for Electronics in Textiles for Wearable Electronics Applications
Published in:
Smart Textiles
(p85)
Fabrication and Testing of 6H-SiC JFETs for Prolonged 500 °C Operation in Air Ambient
Published in:
Silicon Carbide and Related Materials 2007
(p1079)
High Temperature Piezoresistive β-SiC-on-SOI Pressure Sensor for Combustion Engines
Published in:
Silicon Carbide, III-Nitrides and Related Materials
(p1101)
Interpreting Shock Data to Estimate Drop Height Levels During Handling
Published in:
Advances in Experimental Mechanics V
(p243)
Low Cost Fabrication of Micro Glass Cavities For MEMS Wafer Level and Hermetic Packaging
Published in:
MEMS/NEMS Nano Technology
(p23)
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