Papers by Keyword: Peltier

Abstract: In this work, a non-evaporative cooling system is used with an assisted thermoelectric cooler (TEC) devices module. The system was proposed as an alternative cooling system in the high temperature climate to overcome the high energy consumption of traditional air-conditioning compression cycle. The open source Open FOAM V.9 was used to solve the transient effect of 3D model of indirect non-evaporative cooling system. The primary air temperature was set to 319 . While, the air flow was tested under four different air inlet velocities: 0.75 m/s, 1 m/s, 1.25 m/s, and 1.5 m/s. the validation shows good and acceptable agreement in COP values of the system with both experimental and theoretical works from literature within an error between (12.9 % and 9.5 %). Results show that the temperate difference value on a slice through the length of the air channel starts to decrease as velocity increasing. For example, at the last timesteps of each velocity, the temperature difference reaches about (~10 ^oK) when velocity is (0.75 m/s) starting from the first quarter of the channel, while the same difference in temperature not reached until the half way of the channel from the channel inlet when velocity is (1.5 m/s). Revealing that even though the percentage increase in the velocity is about 50%, the change in the temperature difference value between the inlet and outlet of the channel is about 1.2%. The local Nusselt number shows that steady state heat transfer reached very quickly as the velocity increased (i.e., at 0.75 m/s at 12s while for 1.5 m/s at 4s). Notwithstanding, as the time processed the ( increases for all cases but becomes lower as the velocity increased. .

Abstract: The rapid prototyping with ice is a new manufacturing technology that can generate three-dimensional objects from ice by depositing and rapidly freezing water layer by layer. In order to freeze the water droplets, the plate must meet certain conditions, among those it is worth to be mentioned, the surface temperature, which should not surpass 0°C. The equipment presented in the paper is a part of rapid freeze prototyping equipment, designed and built by the authors. The authors analysed various freezing systems and they discovered that the classical cooling systems are not appropriate to be used in rapid freeze prototyping technology. The unique solution is the utilisation of thermoelectric cells, generic named as Peltier cells. The modern technology can be used in obtaining Peltier cells, with a high degree of reliability, electrical consumption and yield. This can be successfully used as heat pumps in industry. The author developed an original system that permitted to implement the Peltier cells. The cold plate was designed by using CAD software. In addition, the cold plate was produced and tested. The equipment obtained, has a greater power in comparison with the classical ones, even if it has smaller dimensions. The electrical power supply has to be well filtered in order to generate a higher efficiency. Through the main advantages of the Peltier cells can be mentioned: no maintenance have to be performed as this type of cells have no moving parts, thus having a major advantage; no CFC or other consumables parts have to be used, thus proving to be more economical than other systems; the heat regulation can be performed easier compared with the classical systems offering a better control and precision; it can be used in severe environments where conventional cooling systems can fail, being successfully used in the presence of liquid nitrogen; it can perform in various positions and is reversible similar to heat pumps. The main drawback of this system is that it uses a great amount of electrical energy, consequently can have a low yield.

Abstract: We have studied a novel Peltier device having a metallic tip which is directly sandwiched between P-type and N-type thermoelectric materials. The tip can be heated and cooled directly driven by Peltier effect, resulting in high thermal response. In this study, we report the fabrication of a portable thermal cycler using a PN sandwich-structure Peltier device. The device has copper plates with minute fin to efficiently radiate heat.

Abstract: We have proposed and fabricated a NN-type Peltier device. The conventional Peltier devices have a structure called π-shaped, which is required to have both P-type and N-type thermoelectric materials. On the other hand, our NN-type Peltier device proposed here is only composed of N-type (or P-type) thermoelectric materials. In this study, we fabricated an NN-type Peltier device with a T-shaped stage, and the current dependence of the stage temperature was measured both for cooling and heating.

Abstract: This study is to measure accurate temperature at a point which is cooled and heated. We proposed and fabricated a new Peltier device with a coaxial thermocouple composed of constantan and copper. Current dependence of temperature of the head of the coaxial thermocouple was measured, and it was shown that in cooling operation, the difference between designated temperatures and calibrated ones was as small as within 1°C.

Abstract: The deposition and characterization of n-type Bi2Te3 and p-type Sb2Te3 semiconductor films are reported. The films were deposited by thermal co-evaporation on a 25 µm thick polyimide (kapton) substrate. The co-evaporation method is inexpensive, simple, and reliable, when compared to other techniques that need longer time periods to prepare the starting material or require more complicated and expensive deposition equipment. Seebeck coefficients of -189 µVK-1 and +140 µVK-1 and electrical resistivities of 7.7 µ0m and 15.1 µ0m were measured at room temperature on n-type and p-type films, respectively. These values are better than those reported for films deposited by co-sputtering or electrochemical deposition, and are close to those reported for films deposited by metal-organic chemical vapour deposition or flash evaporation. Because of their high figures of merit, these films will be used for the fabrication of a micro-Peltier element, useful in temperature control and laser-cooling for telecommunications.