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Articles by keyword: «Planarization»

• A Material Removal Modeling of Chemical Mechanical Polishing Based on Micro-Contact Mechanism
  Published in: Advanced Materials and Computer Science (p472)
• A Study on the Characteristics of Micro Electropolishing for Stainless Steel
  Published in: Mechatronics and Materials Processing I (p474)
• Abrasive-Free Planarization of 3-Inch 4H-SiC Substrate Using Catalyst-Referred Etching
  Published in: Silicon Carbide and Related Materials 2010 (p493)
• Approach of Realizing Material Removal at Nanometer Level in Ultraprecision Polishing
  Published in: Advances in Grinding and Abrasive Processes (p466)
• Damage-Free Planarization of 2-Inch 4H-SiC Wafer Using Pt Catalyst Plate and HF Solution
  Published in: Silicon Carbide and Related Materials 2007 (p835)
• Development of Inorganic Gas Barrier Material in Solar Cell Devices for Planarization Properties and Sublimate Defect Reduction
  Published in: Manufacturing Science and Technology (p3197)
• Effect of Pre-Thin-Surface Grinding on Copper Chemical Mechanical Polishing
  Published in: Advances in Abrasive Technology VI (p407)
• Effects of Electrolyte Formulas on Electrochemical Polish Planarization of Pure Copper
  Published in: Advances in Precision Engineering (p159)
• Electro-Chemical Mechanical Deposition for Planarization of Cu Interconnect
  Published in: Experimental Mechanics in Nano and Biotechnology (p389)
• Essential Aspects of Chemical Mechanical Planarization for Oxide Semiconductor
  Published in: Precision Machining of Advanced Materials (p1)
• Fabrication of Reliable RF MEMS Switches in CPW Configuration
  Published in: NEMS/MEMS Technology and Devices - ICMAT2009 (p259)
• Laser-Assisted CMP for Copper Wafer
  Published in: New Frontiers of Processing and Engineering in Advanced Materials (p351)
• Material-Selective Planarization of Oxide Layers: A Novel Technology
  Published in: Trends and New Applications of Thin Films (p227)
• Planarization of Zinc Oxide Surface and Evaluation of Processing Damage
  Published in: Electroceramics in Japan XIV (p215)
• Preparation of Porous Alumina Abrasives with Different Morphologies and their Chemical Mechanical Polishing Behavior
  Published in: Product Design and Manufacturing (p415)