Keyword: "Planarization"
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A Material Removal Modeling of Chemical Mechanical Polishing Based on Micro-Contact Mechanism

Authors: Shi Wen Du, Yong Tang Li, Jian Jun Song, Hui Ping Qi

472

A Study on the Characteristics of Micro Electropolishing for Stainless Steel

Authors: Sung Hyun Kim, Sang Gyun Lee, Seung Geon Choi, Eun Sang Lee, Seung Bok Choi, Chul Hee Lee

474

Abrasive-Free Planarization of 3-Inch 4H-SiC Substrate Using Catalyst-Referred Etching

Authors: Takeshi Okamoto, Yasuhisa Sano, Kazuma Tachibana, Kenta Arima, Azusa N. Hattori, Keita Yagi, Junji Murata, Shun Sadakuni, Kazuto Yamauchi

493

Approach of Realizing Material Removal at Nanometer Level in Ultraprecision Polishing

Authors: X. Shen, M. Chang, Ju Long Yuan, Ping Zhao, Wen Hong Zhao, L.B. Zhang

466

Damage-Free Planarization of 2-Inch 4H-SiC Wafer Using Pt Catalyst Plate and HF Solution

Authors: Takeshi Okamoto, Yasuhisa Sano, Hideyuki Hara, Kenta Arima, Keita Yagi, Junji Murata, Hidekazu Mimura, Kazuto Yamauchi

835

Development of Inorganic Gas Barrier Material in Solar Cell Devices for Planarization Properties and Sublimate Defect Reduction

Authors: Satoshi Takei

3197

Effect of Pre-Thin-Surface Grinding on Copper Chemical Mechanical Polishing

Authors: Junji Watanabe, Tohru Hisamatsu, M. Hirano

407

Effects of Electrolyte Formulas on Electrochemical Polish Planarization of Pure Copper

Authors: J.C. Huang, Yung Jin Weng, Yung Chun Weng, Y.F. Chan, Hsu Kang Liu, H.S. Fang

159

Electro-Chemical Mechanical Deposition for Planarization of Cu Interconnect

Authors: Suk Hoon Jeong, Heon Deok Seo, Boum Young Park, Jae Hong Park, Sung Min Park, Sang Chul Kim, Kee Ho Kim, Hae Do Jeong

389

Essential Aspects of Chemical Mechanical Planarization for Oxide Semiconductor

Authors: Hong Ho Cheng, H.Y. Tsai, Yue Long Huang

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