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Articles by keyword: «Plasma Etching»

• 6H-SiC MOS Capacitors on Sloped Surfaces: Realisation, Characterisation and Electrical Results
  Published in: Silicon Carbide, III-Nitrides and Related Materials (p1029)
• Angle Resolved XPS Characterization of the Formation of Cl and Br Bonds in Poly-Silicon Etching and Its Cleaning
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p153)
• Characterization of the Post Dry Etch Cleaning of the Silicon Surface Prior to Silicon Epitaxial Growth
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p97)
• Comparison of Direct Numerical Procedure and Monte Carlo Technique to Determine the Charging Effects in Submicron Structures
  Published in: Progress in Advanced Materials and Processes (p9)
• Cutting of SiC Wafer by Atmospheric-Pressure Plasma Etching with Wire Electrode
  Published in: Silicon Carbide and Related Materials 2011 (p865)
• Data Bases for Modeling Plasma Devices for Processing of Integrated Circuits
  Published in: Progress in Advanced Materials and Processes (p15)
• Double-Step Plasma Etching for SiO₂ Microcantilever Release
  Published in: NEMS/MEMS Technology and Devices - ICMAT2011 (p140)
• Field Emission Characteristics of AlN Coated Silicon Nanocone Arrays
  Published in: Nanoscience and Technology (p797)
• Influence of Charging on SiO₂ Etching Profile Evolution Etched by Fluorocarbon Plasmas
  Published in: Research Trends in Contemporary Materials Science (p53)
• Interaction and Migration Properties of Ion Beam Induced Point Defects in Crystalline Silicon: Basic Research and Technological Relevance
  Published in: Diffusion in Silicon (p137)
• Laser Pulsed Induced Microwave Conductivity and Spectroscopic Ellipsometry Characterization of Helium and Hydrogen Plasma Damage of the Crystalline Silicon Surface
  Published in: Semiconductor Processing and Characterization with Lasers (p209)
• Nonequilibrium Plasmas for Material Processing in Microelectronics
  Published in: Advanced Materials and Processes (p47)
• Optimisation of a Home-Made RIE System - Effect of SF₆ Plasma on the Properties of Partially Etched a-Si:H Films
  Published in: Advanced Materials Forum II (p124)
• Plasma Chemical Vaporization Machining of Silicon Carbide Wafer Using Flat-Bar Electrode with Multiple Gas Nozzles
  Published in: Ultra-Precision Machining Technologies (p160)
• Plasma Etching for Backside Wafer Thinning of SiC
  Published in: Silicon Carbide and Related Materials 2006 (p729)