Papers by Keyword: Polytype Inclusions

Abstract: The 3C-SiC layers on nominally on-axis 6H-SiC substrates were grown using sublimation epitaxy. More than 90% coverage by 3C-SiC is typically achieved at growth temperature of 1775°C. The main reason for the polytype inclusions to appear is local supersaturation non-uniformities over the sample surface which appear due to the temperature gradient and spiral growth nature of 6H-SiC. On the 6H-SiC spirals with small steps supersaturation is smaller and 3C-SiC nucleation and growth is diminished. Due to surface free energy and surface diffusion differences, polytype inclusions appear differently when 3C-SiC is grown on the Si- and C-faces. The 6H-SiC inclusions as well as twin boundaries act as neutral scattering centers and lower charge carrier mobility.

Abstract: The move towards commercialization of SiC based devices places increasing demands on the quality of the substrate material. While the industry has steadily decreased the micropipe (MP) levels in commercial SiC substrates over the past years, the achievement of wafers that are entirely free of MPs marks an important milestone in commercialization of SiC based devices. We present the results of a study for controlling the nucleation and propagation of MP defects in SiC ingots grown via PVT. Our studies confirm that during bulk growth of SiC, foreign polytype nucleation such as 3C-polytype occurs at the initial stages of growth (nucleation period) and/or during subsequent growth in the presence of facets. Results in this investigation suggest that polytype instability during crystal growth adversely impacts the MP density. Based on this key concept, growth conditions for nucleation and growth stages were optimized. These conditions were subsequently implemented in an innovative PVT growth environment to achieve a growth technique with highly effective polytype control. Under continuously modulated growth conditions, MPs induced by seed material and/or formed during the growth were eliminated. 2-inch and 3-inch diameter MP-free (zero MP density) conducting 4H-SiC ingots were obtained.