Papers by Keyword: Precision Processing

Abstract: To the processing requirements of high precision small dimension and high surface quality for internal spherical surface with through hole processing, a new technological method of precision turning was proposed in this paper, the processing equipment and control system were designed and developed, the parameters of precision turning technology were given. Through precision turning experiment’s verification, this technological method of precision turning can satisfy processing requirement, and has features of simple, high efficiency, and low processing cost. Some comparative research in various small dimension precision turning technology for internal spherical surface were also made in this paper, and conclusions full of research and processing reference value were drawn.

Abstract: The semibonded abrasive machining technique is expected to get high surface integrity and processing efficiency attributed to the „trap‟ effect which can reduce or even eliminate the surface damage induced by the larger particles. The goal of the work is to validate the „trap‟ effect by the experiments of semibonded and loose abrasive machining under the conditions of adding and not adding the larger particles. Free surface damage monocrystal silicon wafers after polishing are adopted as workpieces, and 1000# SiC as abrasive particles while 180# SiC as the larger particles. The cast iron plate is used as grinding plate in the loose abrasive machining and different bond concentration semibonded abrasive grinding plate SSB-1 and SSB-2 are used as grinding plates in semibonded abrasive machining. The roughness Rv and SEM photos of workpieces surface are tested to evaluate the extent of „trap‟ effect. The result shows that the semibonded abrasive grinding plate has the „trap‟ effect. The shore hardness value of the semibonded abrasive grinding plate can be used to be one parameter to evaluate the degree of the ‟trap‟ effect of the semibonded abrasive grinding plate.