Papers by Keyword: Pyrex Glass

Abstract: Electrochemical discharges machining (ECDM) is an unconventional technology able to machine several non-conductive materials like glass or some ceramics. ECDM technology remains an academic application and was never applied in industrial. The limit factors are highlighted. In order to improve removal rate (MRR) of Pyrex glass ECDM material and the surface quality, many promising measures such as ultrasonic vibration, abrasive, and side-insulated electrode are discussed.

Abstract: The principles of ECDM and micro-milling were described in the article. The ECDM technology and micro-milling technology were combined, and a milling platform was designed, through the analysis of the affecting factors in the processing, the Pyrex glass was machined by using the electrochemical discharge micro-milling machining and the experiment results were discussed. The results showed that the electrochemical discharge milling machining had a good prospect for the micro machining of the non-conductive materials.

Abstract: The negative effect of the conventional laser bonding caused by high temperature has been analyzed in the Si-glass bonding process. A new method which is the combination of chip surface activated pre-bonding and laser bonding has been proposed. The method has been used for Micro Electro Mechanical System package experiment. The process is: firstly, a hydrophilic surface was formed by using a special chemical method. Secondly, Si and glass were pre-bonded at room temperature. Finally, the laser with the wavelength of 1.070 μm, spot diameter of 480 μm, power of 70 W was local heated by the laser. This method achieves low-temperature bonding without external press. And the tensile test also shows that the strength of sample bonding reaches 2.8 MPa~3.2 MPa. So it not only ensures the quality of MEMS chip, but also reduces the cost of the package.

Abstract: In this paper the technological experiments of static bonding has been carried out in the bonding of multi-layer Pyrex7740 Glass and Al. The joining mechanism is analyzed with SEM and EDX. It’s observed that bonding region across the interface consists of the metal layer, oxide transitional layer and the glass layer. The bonding process can mainly be categorized into anodic process and solid state diffusing process. The pile-up of the ions and its drift in the interface area are the main reasons for anode oxidation and joining successfully. The analysis of the shear stress and deformation in the static bonded samples was made by MARC. Modeling studies showed the maximum shear stress of bonded samples all occur in the transition layer. It also shows the shear stress and deformation in the three-layer samples is significantly smaller than that in the two-layer samples. This has an important advantage in MEMS fabrication.

Abstract: A method of fabrication of micro via-hole by wet-etching of Pyrex glass is presented in the paper. The through holes with double funnel-shape have been fabricated attribute to isotropic etching. Furthermore, the funnel-shape holes are advantageous to the joint sealing and have been applied to fabricate microfluid chips. The results show that the proportioning of corrosion solution is HF:HCl:H2O=3:6:10, and the corrosion rate is about 0.67um/min, the diameter of the holes on the both-side of the wafer is only 750 um, the middle ones are 300um

Abstract: The state of knowledge of anodic bonding is reviewed, paying particular attention to the creation of intimate contact and to the microstructure of anodic bonds formed between silicon and Pyrex. Equivalent electrical circuit models of differing degrees of sophistication which have been proposed in the literature to predict the current-time characteristics observed experimentally for a range of conditions of applied voltage and temperature in anodic bonding are critically analysed. It is shown that relatively simple equivalent circuit models comprising capacitors and resistors can be used to account for the main features of the observed current-time characteristics, but that these require the assumption of large relative permittivities for the capacitative components in the models.