HOME CONTACT My eBook

Username: Password:

> @scientific.net

Articles by keyword: «Removal Rate»

• Advanced Treatment of Secondary Sewage Effluent by Iron-Carbon Internal Electrolysis
  Published in: Environmental Biotechnology and Materials Engineering (p291)
• An Approach to the Influence of Flotative Abrasive Balls on Polishing Process
  Published in: Advances in Materials Manufacturing Science and Technology II (p393)
• Analyses of CMP Mechanism of NiP Substrate of Computer Hard-Disk with Alkali Slurry
  Published in: Material and Manufacturing Technology (p580)
• Basic Characteristics of a Simultaneous Double-Side CMP Machine, Housed in a Sealed, Pressure-Resistant Container
  Published in: Advances in Precision Engineering (p61)
• Chemical Effect on the Material Removal Rate in the CMP of Silicon Wafers
  Published in: Advances in Abrasive Technology XIII (p511)
• Chemical Mechanical Polish of Potential New Barrier Material Ruthenium (Ru) in ULSI Copper Interconnects
  Published in: Anti-Fatigue Design and Manufacturing Technologies I (p33)
• Effect of Microstructure on Mechanical Properties and Wear Characteristics of Cemented Tungsten Carbides
  Published in: Advances in Abrasive Technology XII (p609)
• Effect of Sewage Load Shock on Channel Disposal by Bio-Film Process
  Published in: Chemical Engineering and Material Properties (p134)
• Effect of Water Flow Pattern on the Treatment of Discharged Sewage by Biological Accelerator-Bio-Film Process
  Published in: Chemical Engineering and Material Properties (p130)
• Effects of Reverse Micelles-Complexation-Supercritical CO₂ Extraction Conditions on Removal of Pb, Hg and as Ions in Lotus Leaf
  Published in: Fundamental of Chemical Engineering (p585)
• Effects of Surfactant Concentration on Step Height Reduction of SiO₂ in Chemical Mechanical Polishing with Ceria Slurry
  Published in: Multi-functional Materials and Structures (p1494)
• Gas-Liquid Combined Multiple Cut for WEDM
  Published in: Machining and Advanced Manufacturing Technology X (p511)
• High Precision Finishing Technique of Sapphire Substrate Surface for Photoconducting Device
  Published in: Optoelectronic Materials (p80)
• Hydration Polishing of Sapphire
  Published in: Digital Design and Manufacturing Technology (p695)
• Investigation on Supersmooth Surface Machining with Stable Eccentric Immersed Polishing
  Published in: Computer-Aided Design, Manufacturing, Modeling and Simulation (p461)