Papers by Keyword: Schottky Barrier Height

Abstract: In this paper, the impact of substrate preconditioning by ion bombardment in-situ in a conventional sputter equipment on n-doped 4H-silicon carbide (SiC) Schottky diodes with molybdenum nitride metallization is studied. By variation of the plasma power during argon ion bombardment, the effective barrier height is adjustable in the range from 0.66 to 0.96 eV, as deduced by current / voltage measurements over a wide temperature range. Therefore, this approach offers a straightforward method to tailor the Schottky barrier height over a significant range by introducing an insitu substrate pretreatment step available in most sputter equipment.

Abstract: Schottky barrier diodes (SBD) were fabricated on SiC surfaces that had been treated with different surface passivation techniques, so that metal-semiconductor analysis could be used to evaluate the quality of this surface. In this paper, we discuss the results of this study that used Current-Voltage (I-V), Capacitance-Voltage (C-V) and Current-Voltage-Temperature (I-V-T) analysis to look at the impact of untreated oxidation, Nitrous oxide (N₂O) and Phosphorus Silicate Glass (PSG) treatments prior to oxide removal, and the formation of Mo, Ni and Ti diodes. While the results of this study did not reveal any consistent patterns between the different treatments, a Mo diode formed on a surface after PSG treatment, displays exceptionally low leakage (4.44×10^-5 A/cm² at 19°C; 7.26×10^-4 A/cm² at 300°C) given a low barrier height (1.27 eV). Moreover, the barrier heights extracted from C-V analysis before contact annealing show a variation across all the diodes, suggesting that the interface is greatly suffering from Fermi-Level pinning, the result of significant interface traps.