| Paper Title | Page |
|---|---|
|
In Situ Study of the Altering Globule Packing-Density during Semisolid Alloy Deformation Authors: C.M. Gourlay, T. Nagira, Kentaro Uesugi, Hideyuki Yasuda |
185 |
|
A Thermomechanical Model Dedicated to Thixoforming. Application to Semi-Solid Forming Authors: Roxane Koeune, Jean Philippe Ponthot |
269 |
|
Alloys for Semi-Solid Processing Authors: Helen V. Atkinson |
16 |
|
Authors: Qin Yue Pan, Stuart Wiesner, Diran Apelian |
402 |
|
Authors: Stuart Wiesner, Qin Yue Pan, Diran Apelian |
64 |
|
Authors: M. Hajian Heidary, M. Bigdeli, A. Mahdavi, F. Khomamizadeh |
391 |
|
Continuous Casting of Magnesium Billets for Semi-Solid Processing Authors: Hwa Chul Jung, Kwang Seon Shin |
517 |
|
Continuous Fabrication of Sound Semi-Solid Slurry for Rheoforming Authors: Hong Min Guo, Xiang Jie Yang |
425 |
|
Controlling the Semisolid Grain Size during Solidification Authors: David H. StJohn, Mark Easton, Ma Qian |
355 |
|
Development and Application of a New Al-Si-Mg Alloy for Semi-Solid Forming Authors: Xiao Hu Pei, Yi Tao Yang |
670 |