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Articles by keyword: «Silicon Wafer»

• A Fundamental Modeling Approach for Nano-Grinding of Silicon Wafers
  Published in: Progress on Advanced Manufacture for Micro/Nano Technology 2005 (p253)
• A Method for Grinding Mode Identification in Grinding of Silicon Wafers
  Published in: Precision Surface Finishing and Deburring Technology (p255)
• A Method for Quantitative Evaluation of Electrical Conductivity of Silicon Wafers by Millimeter-Waves
  Published in: Advances in Nondestructive Evaluation (p41)
• A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-Precision Grinding of Silicon Wafers
  Published in: Advances in Abrasive Technology XIII (p707)
• A Novel Single Step Thinning Process for Extremely Thin Si Wafers
  Published in: Advances in Abrasive Technology XII (p434)
• A Study of Double Sided Polishing Process for Ultra-Smooth Surface of Silicon Wafer
  Published in: Advances in Materials Manufacturing Science and Technology II (p472)
• Achieving High Flatness of Workpiece Edge Shape by Considering Polishing Pressure
  Published in: Advances in Precision Engineering (p71)
• Analysis on the Contact Pressure Distribution of Chemical Mechanical Polishing by the Bionic Polishing Pad with Phyllotactic Pattern
  Published in: Digital Design and Manufacturing Technology II (p217)
• Application-Specific Wafer Reclaim
  Published in: Gettering and Defect Engineering in Semiconductor Technology X (p623)
• Basic Characteristics of a Simultaneous Double-Side CMP Machine, Housed in a Sealed, Pressure-Resistant Container
  Published in: Advances in Precision Engineering (p61)
• Block Treatment of Multi-Layer Wafers for the Development of a Numerical Model of a 300mm Batch Heat Treatment Furnace
  Published in: THERMEC 2006 Supplement (p537)
• Casting Technologies for Solar Silicon Wafers: Block Casting and Ribbon-Growth-on-Substrate
  Published in: Gettering and Defect Engineering in Semiconductor Technology X (p149)
• Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers
  Published in: Advances in Abrasive Technology XI (p36)
• Crack Detection and Analyses Using Resonance Ultrasonic Vibrations in Full-Size Crystalline Silicon Wafers
  Published in: Gettering and Defect Engineering in Semiconductor Technology XI (p509)
• Design of Digital Filters for Si Wafer Surface Profile Measurement – Noise Reduction by Lifting Scheme Wavelet Transform
  Published in: Advances in Abrasive Technology XIII (p732)