Papers by Keyword: Single Grain Grinding

Abstract: Grinding is a very complex machining process. Single grain grinding methods are useful to study complex grinding action. Very low speed single-grain grinding tests were carried out for 45 steel and 20Cr alloy with 14# ZA grain. The grinding groove width and depth, the grinding force ratio, specific grinding forces, and grain wear and fracture are studied. The plowing decreases with the grinding section area or grinding depth increase. The average tangential force at grain fracture in the experiments is 54.4N; the average normal force at grain fracture is 949.6N. The ratio of tangential-to-normal force varies suddenly when grain fracture.

Abstract: Grinding of single crystal silicon may be achieved by two modes of material removal: ductile mode and brittle mode. Knowing of the brittle to ductile transition point at which the grinding process changes from the brittle mode to ductile mode is critically important for the realization of ductile mode grinding. This paper uses a new single grain diamond grinding method developed recently by the authors to investigate the brittle to ductile transition during grinding of single crystal silicon in all around. The results indicate that there exist four stages of brittle to ductile transition as the depth of cut is reduced: firstly, the surface cracks outside the grinding groove disappeared, secondly
cracks on the bottom of the groove disappeared, then the lateral cracks ceased in the subsurface region, and finally the median crack is suppressed beneath the grooves. It is not until the depth of cut reaches the last transition point that a crack-free groove can be produced, therefore, the last transition stage is decisive. The critical depth of cut delineating the brittle to ductile transition point derived based on this criterion is 40 nanometers, which is much lower than that based on surface cracks.