Scientific.Net: Materials Science

Paper Title	Page
Analysis of Stress-Strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints Authors: Ikuo Shohji, Tatsuya Kobayashi, Tomotake Tohei	76
Characterization of Sn-3.5Ag-1.0Cu Lead-Free Solder Prepared via Powder Metallurgy Method Authors: Iziana Yahya, Noor Asikin Ab Ghani, Mohd Arif Anuar Mohd Salleh, Hamidi Abd Hamid, Zainal Arifin Ahmad, Ramani Mayappan	160
Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint Authors: Ikuo Shohji, Tomotake Tohei, Keisuke Yoshizawa, Masaharu Nishimoto, Yasushi Ogawa, Takayuki Kawano	433
Fabrication of Lead Free Micro Solder Powder by Melts Dispersion Technique Authors: Jeong Il Youn, Won Ha, Young Jig Kim	570
Sn-Rich Phase Coarsening in Sn-Ag-Cu Solder Joint during Moderate Current Stressing Authors: N. Saud, Azman Jalar	212
Wetting and Intermetallic Study between Sn-3.5Ag-1.0Cu-xZn Lead-Free Solders and Copper Substrate (x = 0, 0.1, 0.4, 0.7) Authors: Ramani Mayappan	150

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