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Articles by keyword: «Solder Joint»

• A Comparative Study of the Solder Joint Reliability in Flip Chip Assemblies with Compliant and Rigid Substrates
  Published in: Progresses in Fracture and Strength of Materials and Structures (p2932)
• A Method of Damage Mechanics Analysis for Solder Material
  Published in: Fracture and Strength of Solids III (p367)
• Abnormal Tin Whisker Growth in Rare Earth Element-Doped Sn3Ag0.5CuXCe Solder Joints
  Published in: THERMEC 2006 (p4019)
• Application of Finite Element Method in Optimal Design of Flip-Chip Package
  Published in: Advances in Materials and Processing Technologies II (p1660)
• Comparison of Reliability of Solder Joints by FORM and SORM
  Published in: Progresses in Fracture and Strength of Materials and Structures (p2593)
• Computational Simulation of the Joint Shape after as-Reflowed Soldering
  Published in: Testing and Evaluation of Inorganic Materials I (p651)
• Deformation Evaluation of Solder Ball Joints by Electromotive Force
  Published in: Advances in Experimental Mechanics VI (p233)
• Effect of Filling with Adhesive on Solder Alloys Subjected to Random Vibration
  Published in: History of Mechanical Technology and Mechanical Design 2012 (p34)
• Failure Mechanism of Electromigration in Solder Joint
  Published in: Materials and Product Technologies (p905)
• Finite Element Analysis on the Ability of Solder Joints to Resist Thermal Fatigue
  Published in: Materials and Product Technologies II (p738)
• Impact of a Combined Use of Focused Ion Beam Technique and Transmission Electron Microscopy on Materials Characterization
  Published in: PRICM-5 (p9)
• Isothermal Aging Effects on the Microstructure, IMC and Strength of SnAgCu/Cu Solder Joint
  Published in: Progresses in Fracture and Strength of Materials and Structures (p2928)
• Micro Impact Testing of Lead Free Solder Joints
  Published in: Frontiers in Materials Science and Technology (p99)
• Nonlinear Analysis of a Ball Grid Array Package under Thermal Cycles
  Published in: Frontiers in Materials Science and Technology (p57)
• Numerical Simulation for the Thermal Fatigue of Flip Chip Solder Joints
  Published in: Manufacturing Science and Engineering I (p3963)