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Articles by keyword: «Soldering»

• A New Approach to Calculate Liquid-Vapor Surface Energy Using Sessile Droplet Test
  Published in: PRICM-5 (p2761)
• Application of TLP (Transient Liquid Phase) Bonding Method to the High T_m Lead-Free Solder
  Published in: PRICM-5 (p1869)
• Bonding of Aluminum Alloy by Hot-Dipping Tin Coating
  Published in: Frontiers in Materials Science and Technology (p93)
• Crack-Less Wafer-Level Packaging Using Flash Heating Technique for Micro Devices
  Published in: THERMEC 2011 (p1979)
• Development of Cu-Clad Metallic Glass for Soldering
  Published in: THERMEC 2011 (p1343)
• Development of Multi-Layered and Graded Die Coatings for Materials Processing Applications
  Published in: 11th International Ceramics Congress (p1145)
• Expansion of Utilizing Temperature Range of Bi₂Te₃/PbTe by FGM Forming
  Published in: Functionally Graded Materials (p693)
• Gallium Distribution in Gallium-Coated Aluminum for Brazing Application
  Published in: Grain Boundary Diffusion, Stresses and Segregation (p255)
• Low Heat Joining – Manufacture and Fatigue of Soldered Locally Strengthened Structures
  Published in: Creation of High-Strength Structures and Joints by Setting up Local Material Properties (p101)
• Mechanical Properties of Flip-Chip Solder Joints Effected by Electromigration
  Published in: Manufacturing Process Technology (p1009)
• Microstructure Evolution of Sn-2.5Ag-2.0Ni Solder Joint with Various Ni Platings on SiC_p/Al Composites
  Published in: THERMEC 2009 (p3811)
• Modeling, Analysis, and Simulation of Soldering Process for FPC Connector
  Published in: Materials Processing Technologies (p643)
• New Adhesion Process Based on Lead-Free Solder Applied in Electronic Power Devices
  Published in: Advanced Materials Forum I (p92)
• Predication of Wettability of Sn Droplet on Copper Plate by MEAM Method
  Published in: Physical and Numerical Simulation of Material Processing VI (p775)
• Soldering and Brazing Metals to Ceramics at Room Temperature Using a Novel Nanotechnology
  Published in: 11th International Ceramics Congress (p1578)