Papers by Keyword: Solution Growth

Abstract: We have investigated the dependence of the macrostep height on various additives in solution growth of n-type 4H-SiC. Surface modification by adding transition elements in periods 4‒6 (Sc, Ti, V, Mn, Fe, Co, Ni, Cu, Y, Nb, Mo, Ce, and W) and group 13‒14 elements (B, Al, Ga, Ge, Sn) was systematically studied to find additives improving smoothness of the growth surface. We found that Sc, Co, Mo, and Ge improved surface smoothness in addition to the already-known additives, such as Al, B, and Sn. Besides, these additives (Sc, Co, Mo, Ge) give no measurable influence on the conductivity of n-type grown crystals. These results demonstrated that Sc, Co, Mo, Ge and Sn are useful additives for solution growth of n-type 4H-SiC.

Abstract: The dislocation behavior during bulk crystal growth on the 4H-SiC (000-1) C-face using the solution method was investigated. A 2 inch wafer with a 4° off angle was fabricated from a bulk crystal grown by the TSSG method, and the dislocations in the crystal were evaluated using synchrotron X-ray topography and TEM observation. From the topograph images, it was found that the TSD density remarkably decreased as the growth progressed. Furthermore, the TEM observation suggested that TSD decreases as the threading dislocations convert to in-plane defects toward the center of the crystal. Conventionally, it was considered that conversion of threading dislocations hardly occurs in solution growth on the C-face. However, it is thought that this phenomenon was not observable because the conversion efficiency is remarkably low. We speculate that dislocations may be transformed by suddenly making macrosteps during bulk growth.

Abstract: SiC crystals are grown using a Si-Cr-based solvent by a top-seeded solution growth (TSSG) method by changing the dipping time after when the growth temperature is reached. Step-flow-like curve morphologies were observed for a dipping time after 15 min, while polycrystallization occurred at the periphery for that after 120 min, which corresponded to the dipping under unsaturated and supersaturated carbon in the solvent, respectively. Furthermore, the solution growth of SiC with dipping under unsaturated carbon was easily realized by the growth from the crucible bottom, step-flow-like growth was achieved. Using this technique, dominant polytypes of SiC in various growth conditions after stable seed dipping under the unsaturation in the solvent can be demonstrated.

Abstract: We have succeeded in solution growth of SiC from Cr solvent without Si using ceramic SiC as the SiC source. The effect of the growth conditions, such as the liquid height in the crucible, on the crystal quality in solution growth of SiC from Cr solvent was investigated. For a liquid height in the crucible of up to 10 mm, the growth rate increases with increasing liquid height and the SiC crystals are a single polytype, while the growth rate decreases and the crystals are polycrystalline for a liquid height above 10 mm. In the former case, the balance between dissolution and transportation of the solute are comparable. The latter case is expected to be transportation limited because transportation of free C and Si atoms is inhibited by excrescent crystals in solution and the increase in the distance for solute transportation. In addition, a higher growth temperature leads to growth of only 4H-SiC.

Abstract: This study reports our newly developed technology for SiC solution growth. In particular, we succeed in completely suppressing solvent inclusions, which have been a serious technological problem peculiar to the solution growth method. Then, we fabricate two-inch-diameter 4° off-axis SiC wafers without solvent inclusions. Moreover, we performed their crystal defects evaluation. It was found that our wafers were low resistance n-type 4H-SiC and contain almost no basal plane dislocation. As a result, the superior quality of our solution-grown crystal was confirmed.

Abstract: We achieved a high growth rate in solution growth of AlN single crystal by suppressing unintentional precipitations near the surface of solvent and by increasing the equilibrium nitrogen concentration in the solvent. In order to suppress unintentional precipitations, we made the solvent supersaturated just above the surface of the substrate by optimizing the composition of the solvent and the temperature distribution based on thermodynamic numerical analysis. In particular, we focused on interactions between nitrogen or aluminum and solvent elements, leading to the increase of the equilibrium nitrogen concentration. We selected chromium and cobalt due to their high affinity with nitrogen or aluminum. Consequently, we successfuly achieved growth rate as high as 200 μm/h in maximum.

Abstract: We developed a solution growth process related to the combination of the Vertical Bridgman and Vertical Gradient Freeze in a metal free Si-C melt at growth temperatures of 2300 °C. For this procedure we present a detailed description of the growth process and discuss the influence of different growth parameters on the surface morphology and growth rate. So far, we managed to grow SiC layers with a thickness up to 300 μm. The characterization of the crystal morphology was carried out using SEM images and the metal concentration was estimated using SIMS.

Abstract: We investigated the spatial distribution of carrier concentration in n-type 4H-SiC grown by the solution method from the peak frequency of the longitudinal optical phonon-plasmon coupled (LOPC) mode of the Raman spectra on the surface. The carrier concentration at the position of the smooth terrace was higher than the carrier concentration at the position where the macrosteps were formed. This indicates the nitrogen incorporation efficiently occurs on the smooth surface where the density of macrosteps is relatively low. The different incorporation of nitrogen depending on the surface morphology can be understood from the view point of the adsorption time of impurity on the terrace. The present result implies that the uniform surface morphology is necessary to achieve uniform doping concentration in SiC crystal.

Abstract: Solution growth of high-quality 4H-SiC bulk crystals has been performed by using Si-Cr based melt at 2000°C. Through enlargement of crystal diameter which is controlled by meniscus height during growth, dislocation free area has been successfully obtained on the periphery of the crystal. However, the threading dislocations in the seed crystal have penetrated into the grown crystal and have been located around the center of the crystal. To reduce dislocation density in the grown crystals, we have used threading-dislocation-free seedcrystals prepared by solution growth on (1-100). The solution growth on the seed crystal sliced from the (1-100) crystal has resulted in very low dislocation density of grown crystals. In an area of 16 mm² for the growth surface, no dislocation has been detected.

Abstract: Using a sessile drop method, investigation of the surface reconstruction of a Si-face, 4°off (0001) 4H-SiC surface in contact with pure silicon or Al-Si alloys has been carried out in the 1600-1800°C temperature range. In pure silicon and at 1600°C, the surface evolves with a two stage process: i) a fast step-bunching leading to parallel macrosteps and ii) a slower step leading equilibrium morphology, composed of (0001), (10-1n) and (01-1n) facets. Increasing the temperature to 1800°C or adding a few percents of aluminium drastically enhance the first stage, but strongly reduce the second one.