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Articles by keyword: «Stress Gradient»

• A In Situ Measuring Method for Stress Gradient of a MEMS Film
  Published in: Micro and Nano Technology (p357)
• A new Approach in Residual Stresses Analysis by Speckle Interferometry
  Published in: Residual Stresses VII, ECRS7 (p465)
• An X-Ray Diffraction Method to Determine Stress at Constant Penetration/Information Depth
  Published in: Residual Stresses VII, ECRS7 (p13)
• Analytical Model of Stress Relaxation in 3C SiC Layers on Silicon
  Published in: Silicon Carbide and Related Materials 2010 (p79)
• Application of Image Plate to X-Ray Stress Measurement of Surface Thin Layer
  Published in: THERMEC 2009 Supplement (p383)
• Characterization of Polycrystalline SiC Thin Films for MEMS Applications using Surface Micromachined Devices
  Published in: Silicon Carbide and Related Materials 2003 (p1523)
• Effect of Sacrificial Layer Sizes and Fabrication Process on Deformation Caused by Residual Stress of Center-Anchored Circular Plate
  Published in: Progress on Advanced Manufacture for Micro/Nano Technology 2005 (p109)
• Fatigue Behavior of Medium Carbon Steel by Symmetric Bending Ultrasonic Frequency Method
  Published in: Biotechnology, Chemical and Materials Engineering (p102)
• Local and Non-Local Approaches to Fatigue of Weldments: State of the Art and Possible Developments
  Published in: Advances in Fracture and Damage Mechanics VI (p529)
• Measurement of Residual Stresses in Thin Films by Two-Dimensional XRD
  Published in: Residual Stresses VII, ECRS7 (p613)
• Measurements of Residual Stress in the Field of the Stress Gradient by the Hole Drilling Method
  Published in: Fracture and Strength '90 (p495)
• Mechanical Stress Gradients in Thin Films Analyzed Employing X-Ray Diffraction Measurements at Constant Penetration/Information Depths
  Published in: Residual Stresses VII, ECRS7 (p19)
• Morphological Evolution of Intragranular Void under the Thermal-Stress Gradient Generated by the Steady State Heat Flow in Encapsulated Metallic Films: Special Reference to Flip Chip Solder Joints
  Published in: Theory, Modeling and Numerical Simulation (p151)
• Residual Stresses Gradient Determination in Cu Thin Films
  Published in: Residual Stresses VII, ECRS7 (p595)
• The Effect of Temperature and Sizes on Deformation of Cantilever Rectangular Plate with Double Layer
  Published in: Experimental Mechanics in Nano and Biotechnology (p1157)