Papers by Keyword: Stress Relaxation

Abstract: P92 heat-resistant steel was used to demonstrate that creep rupture life evaluation period could be shorted by the assistant of the creep data from short-period stress relaxation test without reducing the prediction precision. Research showed that the minimum creep rate and the relaxation creep rate were exchangeable, and the stress exponent and the apparent activation energy analysis of the constant strain creep and the constant stress creep showed a similar deformation mechanism at the condition of T and . The creep rupture life predicted through the combination of these two kinds of creep data was closer to the real creep data than that evaluated by the traditional method based on the time to rupture only, and the precision of the evaluated creep strength increased at last 14.5 %.

Abstract: Cyclic deformations of two ferritic, ductile cast irons, SiMo51 and SiMo1000, were studied in air and Ar using a new method, SRTC (stress relaxation with thermal cycling). Locked specimens were thermally cycled up to 800°C with isothermal holds, varying temperature interval, heating/cooling rates and hold times. A description of the mechanical response to thermal cycling of a locked specimen is given.

Abstract: During 4H silicon carbide (4H-SiC) homoepitaxy and post-growth processes, the development of stress relaxation has been observed, in which interfacial dislocations (IDs) are formed at the epilayer/substrate interface, relaxing the misfit strain induced by the nitrogen doping concentration difference between the epilayer and substrate. It is widely believed that an interfacial dislocation is created by the glide of a mobile segment of a basal plane dislocation (BPD) in the substrate or epilayer towards the interface, leaving a trailing edge component right at the interface. However, direct observation of such mechanisms has not been made in SiC before. In this work, we present an in situ study of the stress relaxation process, in which a specimen cut from a commercial 4H-SiC homoepitaxial wafer undergoes the stress relaxation process during a high-temperature heat treatment while sequential synchrotron white beam X-ray topographs were recorded simultaneously. Based on the dynamic observation of this process, it can be concluded that thermal stress plays a role in the relaxation process while the increased misfit strain at elevated temperature most likely drives the formation of an interfacial dislocation.

Abstract: The paper summarizes capabilities of the small punch tests on miniature disc specimens from metallic materials. Results obtained by small punch tests can be correlated with mechanical properties determined by conventional or other miniature tests. Three basic types of small punch test setup: i) static/fracture, ii) creep and iii) stress relaxation are described and the basic quantities that can be obtained are shown. Relations for an assessment of conventional mechanical properties from quantities obtained by small punch test are presented.

Abstract: Small punch testing under constant deflection rate, constant force and constant deflection (i.e. force relaxation) were performed on the new austenitic steel Sanicro 25. Constant deflection rate experiments were correlated to uniaxial tensile tests at room temperature and 700°C with the help of several empirical relationships. Small punch creep testing was performed in as received state. Correlation of the small punch results with uniaxial creep test results was done and the force/stress ratio Ψ and k_SP parameter were determined. The constant deflection small punch test was correlated with the uniaxial stress relaxation test and good agreement was reached.

Abstract: The advantages of applied compressive residual stress on fatigue properties of materials is a well-described topic, but the residual stress state of machine elements can change during application, therefore it is necessary to describe how these changes are related to the operational parameters. So the monitoring of residual stress relaxation gives more details to improve the lifetime. The surface residual stress state evolution of hardened (quenched and tempered), shot peened, 2 side notched quadratic fatigue specimens made of 42CrMO4 steel was investigated nondestructively by X-ray diffraction method. Residual stress state was monitored on the surface with 1 mm spatial resolution in 5 mm environment of the notch. The compressive residual stress relaxation associated the notching and the fatigue test and the reversal of sign of the residual stress (from compression to tension) associated the crack propagation were experimentally showed.

Abstract: Springback of a high strength steel (HSS) sheet of 980 MPa grade was investigated at elevated temperatures ranging from room temperature to 973 K. From U-and V-bending experiments it was found that springback was decreased with increasing temperature at temperatures of above 573 K. Furthermore, springback was decreased with punch-holding time because of stress relaxation. In this work, the stress relaxation behavior of the steel was experimentally measured. By using an elasto-vicoplasticity model, the stress relaxation was described, and its effect on the springback of sheet metals in warm forming was discussed theoretically.

Abstract: Residual stresses are often introduced into aluminum alloys through quenching processes performed to generate the required microstructure. Such residual stresses are known to be deleterious to the integrity of the component. Methods to mitigate residual stresses in quenched components are therefore of great importance. Cold rolling has been proposed as an effective technique to remove residual stresses in large components. In this work, the effectiveness of cold rolling in reducing the residual stresses in quenched blocks AA7050 has been quantified using the neutron diffraction technique. Neutron diffraction measurements have been performed on two blocks one quenched and the other quenched & cold rolled block. Comparing the residual stress distributions pre and post rolling it has been found that cold rolling almost eliminates the tensile residual stresses in the core of the block, however it generates large tensile residual stresses d in a shallow region near the surface of the block.

Abstract: The specimens (980 MPa-grade dual phase steel sheets) were stretched until the pre-defined strain was obtained. Then the specimens were held at the pre-defined strain and measured the change of stress durng holding. We investigated the effects of strain rate and strain at the starting time of holding and whether the stress change during holding could be described by Krempl model. The following results were obtained. First, the stress drop increased with increase of strain rate and the holding time. On the other hand, the stress drop was not affected by strain change at the starting time of holding. Second, initial stress relaxation rate increased with increase of strain rate. However, this strain rate dependency to stress relaxation rate diminished as the holding time became long enough roughly more than 100 s. Third, the stress change during holding obtained by Krempl model accurately agreed with experimental result. It was found that the stress change during holding could be well described by using Krempl model. This suggests that dislocation moves viscously. In addition, the strain rate dependency on stress change during holding could be described by change of the parameter A.

Abstract: The current paper investigates on the creep behavior of 12Cr-Mo-W-0.25V heat resistant steel base on the long-term stress relaxation test data. It is shows that the stress relaxation curve can be divided into 2 stages: the high stress stage has higher apparent activation volume of 79~350 b³ and the low stress stage is 35~78 b³. Besides, the Helmholtz free energy at the high stress stage is 827~1034 kJ/mol which is higher than 210~252 kJ/mol of the low stress stage. Taking both apparent activation volume and activation energy into account, it is assumed that the high stress stage is mainly controlled by dislocation slip and the low stress stage is more related to diffusion.