Keyword:
"Thermal Expansion Coefficient"
| Paper Title |
Page |
|
A Chemical Bonding Approach to Ionic Conduction and Thermal Expansion in Oxide Ion Conductors
Authors: Sachi Taniguchi, Masaru Aniya
|
343
|
|
Anisotropy of Thermal Expansion Coefficient of Pressed Graphite Foam Measured over the Temperature Interval 20-500°C
Authors: I. Zerrouk, S.G. Ionov, V.P. Popov, S. Hamamda
|
241
|
|
Applications of Silicon Nitride Ceramics
Authors: Frank L. Riley
|
479
|
|
Approach to Optimum Layer Structure of Functionally Graded Materials
Authors: Kazuhiro Hasezaki, Yasutoshi Noda
|
29
|
|
Athermal Motion of Grain Boundaries, Twins and Triple Junctions in Zn
Authors: Vera G. Sursaeva
|
801
|
|
Bioactivity of Plasma-Sprayed Diopside Coating In Vitro
Authors: Wei Chang Xue, Chuan Xian Ding, Cong Cao, Yuqi Dong
|
319
|
|
Correlation between Thermal Expansion Coefficients of La2O3-Al2O3-SiO2 Glasses and Strength of the Glass Infiltrated Alumina for all Ceramic Crown
Authors: Ju-Woong Jang, Byung Soo Kim, Hak Kwan Kim, Deuk Yong Lee
|
1193
|
|
Crystallisation, Thermal Expansion and Density of Si-Al-Y-O Glasses for Ceramics
Authors: P. Lichvár, M. Liška, Pavol Šajgalík, Petr Bezdička
|
125
|
|
Crystallization and Thermal Expansion of MgO-Al2O3-SiO2-TiO2 Glass-Ceramics
Authors: Hua Shao, Kai Ming Liang, Feng Zhou, Fei Peng
|
1635
|
|
Development of Welding Distortion Analysis Method Using Residual Strain as Boundary Condition
Authors: Yun Sok Ha, Si Hoon Cho, Tae Won Jang
|
649
|
Showing 1 to 10 of 64 Papers