Papers by Keyword: Thermo-Stress

Abstract: The finite element model of coupling the thermal field with structural analysis is proposed in order to analyze the thermo-stress of casting ladle structure. The thermal fields of casting ladle with refractory lining structure are computed according to the thermal properties of materials and boundary conditions. Numerical simulation shows that that computed outer temperatures of casting ladle agree with measured ones. The thermo-stress of casting ladle structure is simulated by taking thermal loadings as the loading conditions of the steel shell structure. Material behaviors were described by the Drucker–Prager plasticity model and Von Mises yield criterion. Calculation results of thermo-stress fields shows the outer shell structure is safety under the action of thermal loadings.

Abstract: About 25years after inventing the laser annealing effects of ion implanted semiconductors a summary of the related physical phenomena is given. The field of application for short and selectively deposited energy pulses in controlled thermally activated processing is critically reviewed with the emphasis on electrical activation of implanted layers. Starting form the energy deposition and continuing to the excited transport phenomena a set of regimes can be described, which allows the classification of the variety of laser annealing methods and their different application. Within the scope of controlled thermally activated processes in nanometer dimensions old phenomena like phase transitions in strong non-equilibrium to create metastable states or producing dissipative structures by nonlinear coupling effects with self-organization are taken into account for device generations beyond 45nm. The challenges and disadvantages of laser annealing methods for planar semiconductor technology will be elaborated with respect to the current progress in laser development.